Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Consultant / Service Provider, Manufacturer

Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection systems for destructive and non-destructive mechanical testing and inspection of electronic components.

With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGA, Chip Scale Packages (CSP) and other electronic components. More recently Nordson DAGE has been heavily involved in the testing of the newest technology 300 mm wafer bump shear.

Nordson DAGE has developed an excellent suite of award-winning X-ray inspection equipment targeted at both the Semiconductor and PCBA markets.

Control of the patented core technology of X-ray tube manufacture ensures that the high-resolution X-ray will detect, identify and measure even the smallest of features. Nordson DAGE's high precision, state-of-the-art inspection equipment when joined with their sophisticated software offerings, ensure that the equipment is simple to use.

Dage was acquired by the Nordson Corporation in 2006.

Dage has an excellent, wholly owned distribution and support network of seven offices covering Europe, Japan, China, Singapore, and the USA, and maintains representative offices in other territories.

Nordson DAGE Postings

11 products »

Quadra™ 7 X-ray Inspection System

At the cutting edge of X-ray inspection performance, Quadra 7 shows you features and defects as small as 0.1µm, non destructively. Quadra 7 is the X-ray inspection and failure analysis tool of choice in a wide range of industries...

Inspection

Quadra™ 7 X-ray Inspection System

XD7500VR Jade FP - Flat Panel X-Ray Inspection System

New system delivers high technology in cost effective platform. Nordson DAGE, the only X-ray company whose focus is on X-ray electronics inspection, offers the Nordson DAGE XD7500VR Jade FP X-ray inspection system that uses the latest...

Inspection

XD7500VR Jade FP - Flat Panel X-Ray Inspection System

XD7600NT Diamond X-ray Inspection System

The ultimate choice for obtaining the highest magnification X-ray imaging. The unique Nordson DAGE NT maintenance-free, sealed transmissive type of X-ray tube provides 0.1 µm feature recognition and up to 10 W of power.  Plu...

Inspection

XD7600NT Diamond X-ray Inspection System

XD7600NT Diamond Flat Panel X-ray Inspection System

Ultimate Flat Panel X-ray Inspection System The Nordson DAGE XD7600NT Diamond FP X-ray inspection system uses the latest technology, flat panel detector to provide the ultimate choice for the highest quality real time...

Inspection

XD7600NT Diamond Flat Panel X-ray Inspection System

XD7600NT Ruby X-Ray Inspection System

The Benchmark for Demanding Production Applications. Nordson DAGE, the only X-ray company whose focus is on X-ray electronics inspection, offers the Nordson DAGE XD7600NT Ruby X-ray inspection system as the benchmark system for the mos...

Inspection

XD7600NT Ruby X-Ray Inspection System

XD7600NT Ruby FP - Flat Panel X-Ray Inspection System

With 2 megapixel radiation resistant flat panel detector, XD7600NT Ruby FP is the first choice for live imaging and demanding applications. Nordson DAGE, the only X-ray company whose focus is on X-ray electronics inspection, offer...

Inspection

XD7600NT Ruby FP - Flat Panel X-Ray Inspection System

XD7800NT Ruby XL - Large Board X-Ray Inspection System

The Solution for Large Board Applications Nordson DAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the Nordson DAGE XD7800NT Ruby XL x-ray inspection system as the optimum solution for large boards. T...

Inspection

XD7800NT Ruby XL - Large Board X-Ray Inspection System

Xi3400 Automated X-ray Inspection System

Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up. The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection eq...

Inspection

Xi3400 Automated X-ray Inspection System

XM8000 Wafer X-ray Metrology Platform

Fast Automatic X-ray Measurement of TSVs, MEMS and Wafer Bumps for Voiding, Fill Level, Overlay & Other Critical Dimensions. Measuring the Invisible™ This new platform takes the market-leading capabilities from No...

Inspection

XM8000 Wafer X-ray Metrology Platform

Paragon™ Bond Testing Software

Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced functionality, such as automatic GR&R calcu...

Test Equipment - Bond Testers

Paragon™ Bond Testing Software

See all products from Nordson DAGE »

5 technical articles »

Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis

Nov 20, 2023 | David Bernard & Steve Ainsworth

Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspection, not only provides a non-destructive test but also allows investigation within optically hidden areas, such as the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips). As the size of components continues to diminish, today's x-ray inspection systems must provide increased magnification, as well as better quality x-ray images to provide the necessary analytical information. This has led to a number of x-ray manufacturers offering digital x-ray inspection systems, either as standard or as an option, to satisfy these needs. This paper will review the capabilities that these digital x-ray systems offer compared to their analogue counterparts. There is also a discussion of the various types of digital x-ray systems that are available and how the use of different digital detectors influences the operational capabilities that such systems provide....

MODERN 2D / 3D X-RAY INSPECTION -- EMPHASIS ON BGA, QFN, 3D PACKAGES, AND COUNTERFEIT COMPONENTS

Nov 20, 2023 | Evstatin Krastev and David Bernard

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and dense packages have more opportunities to exhibit defects both internal to the package as well as to the PCB. As components increase in complexity their cost increases, making counterfeiting them a potentially lucrative business for unscrupulous individuals and organizations....

Considerations for Minimizing Radiation Doses to Components during X-ray Inspection

Feb 21, 2022 | David Bernard, Richard C. Blish, II

The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips)....

Common Process Defect Identification of QFN Packages

Jul 23, 2019 | David Bernard @ Dage Precision Industries, Bob Willis @ ASKbobwillis.com

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed....

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Sep 16, 2010 | Evstatin Krastev, David Bernard

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de...

141 news releases »

AQS, Inc. Selects DAGE Assure Intelligent X-ray Component Counter for Mass Production

Jun 10, 2021 | Nordson X-ray announces that EMS provider AQS Inc. purchased an Assure™ intelligent X-ray component counter. Nordson X-ray is part of Nordson TEST & INSPECTION. The sale was facilitated by the Texas-based manufacturers' representative Southwest Systems Technology.

SVTronics Implements New DAGE AssureIntelligent X-ray Component Counter in Production

Jun 02, 2021 | Nordson X-ray, a division ofthe Nordson Corporation (Nasdaq: NDSN)is pleased to announce a successful installation of theAssure™ intelligent X-ray component counterto SVTronics. The company purchased the AssureTMfrom Nordson X-ray, part of Nordson TEST & INSPECTION, and the sale was facilitated by manufacturers' representative Southwest Systems Technology.

Intelligent Manufacturing Solutions, LLC.(IMS) Installs AssureTM X-ray Component Counter from DAGE at itsManchester, NH Operation

Jan 06, 2021 | Intelligent Manufacturing Solutions, LLC (IMS) recently installed the Assure™ X-ray Component Counter from DAGE, part of Nordson ELECTRONICS SOLUTIONS, at their Manchester, NH location. More than a Printed Circuit-Board Assembly (PCBA) or Electronics Manufacturing Services (EMS) provider, IMSis a partner committed to working smarter and faster--in a way that puts customers first. The company focuses on high-mix, low-volume production and specializes in rapidly sourcing, assembling and testing short runs quickly, efficiently, and cost-effectively.

New DAGE Prospector™ Micro Materials Tester Impresses with Another Award

Oct 27, 2020 | DAGE Products was awarded a 2020 Mexico Technology Award in the category of Test Equipment for its new DAGE Prospector™ Micro Materials Tester. The award was presented to the company during a Virtual Awards Ceremony that took place Monday, October 26, 2020.

DAGE Assure FLEX, the new Intelligent X-ray Component Counter from Nordson ELECTRONICS SOLUTIONS, Wins GLOBAL Technology Award

Oct 04, 2020 | DAGE, part of Nordson ELECTRONICS SOLUTIONS, is proud to announce that it was awarded a 2020 GLOBAL Technology Award in the category of ID Systems / Component Counters for the DAGE Assure FLEX. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

DAGE AssureFLEX,the new Intelligent X-ray Component Counter from Nordson ELECTRONICS SOLUTIONS, Wins GLOBAL Technology Award

Oct 03, 2020 | DAGE is proud to announce that it was awarded a 2020 GLOBAL Technology Award in the category of ID Systems / Component Counters for the DAGE Assure FLEX. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

DAGE Is Honoured with a Prestigious Queen's Award for Enterprise for International Trade

Apr 30, 2020 | DAGE Products, part of Nordson ELECTRONICS SOLUTIONS, is proud to announce that the company is one of 220 organizations nationally to be recognised with a prestigious Queen's Award for Enterprise. Announced on Tuesday 21 April, DAGE has been recognized for its excellence in international trade.

DAGE AssureTM,the New Intelligent X-ray Component Counter from Nordson ELECTRONICS SOLUTIONS, Wins NPI Award

Feb 06, 2020 | DAGE is proud to announce that it was awarded a 2020 NPI Award in the category of Test and Inspection – AXI for its AssureTM X-ray Component Counter. The award was presented to the company during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

New DAGEProspector™ Micro Materials Tester Impresses with a 2020 NPI Award

Feb 06, 2020 | DAGE, part of Nordson ELECTRONICS SOLUTIONS,was awarded a 2020 NPI Award in the category of First Article Inspection for its new DAGE Prospector™ Micro Materials Tester. The award was presented to the company during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Exceed Testing Demands with the New Nordson DAGE Prospector™ Micro Materials Tester

Dec 10, 2019 | Nordson DAGE announces the launch of its new Prospector™ Micro Materials Tester. The flagship system has the most advanced mechanical testing technology in the DAGE product line, giving it new levels of test flexibility. Its capabilities cover the widest range of test scenarios for micro-components and devices. Developed by Nordson DAGE’s in-house R&D team, Prospector™ enables the full characterization of any device by combining mechanical testing with four other complementary test months – Electrical, Thermal, Acoustic and Optical. These unique combinations give researchers and new product development engineers the ability to test across a wide range of micro applications including coatings and thin films, medical devices, micro-electronics, composites, plastics and fibres.

131 more news releases from Nordson DAGE »

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