ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Manufacturer

We are the industry-leading provider of DEK screen printing equipment and processes for a wide range of customers around the world.

Our advanced materials deposition technologies include screen printers, VectorGuard® stencils, precision screens, flexible tooling and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture and alternative energy component production.

Since the inception of DEK Printing Machines in 1968, our team has been behind some of the industry’s biggest breakthroughs. The introduction of the DEK proven platform philosophy changed the face of screen printing and is now an accepted global industry standard. Other pioneering advances include DEK HawkEye inspection, DEK ProFlow® enclosed head printing, DEK Cyclone understencil cleaning, DEK Gemini dual lane printing and the DEK Solar Eclipse and Apollo photovoltaic metallization platforms.

ASM Assembly Systems has accumulated in excess of 100 DEK product patents and recorded 18,000 DEK printing machine installations – and this figure is growing all the time! Prior to joining ASM, the DEK team numbered over 800 people in facilities all over the world with export to over 50 countries around the globe. Now, as ASM Assembly Systems, the team has grown and our global footprint and resource have increased exponentially.

While DEK’s ownership changed in July 2014, our focus on delivering the most advanced and cost-effective printing solutions remains at the core of the DEK development philosophy. With our Placement Solutions Division SIPLACE colleagues and the backing of ASM Pacific Technology, Ltd., we are poised to deliver transformational technologies that will enable even more efficient SMT processes and foster our ongoing commitment to printing excellence. Together #1

ASM Assembly Systems (DEK) Postings

10 products »

NeoHorizon iX - Screen Printer

With its modular design, the latest generation of our powerful screen printers is customizable for any customer-specific or application-specific requirements. Clamping systems, conveyors, toolings, paste management, verification, the new version o...

Printing

NeoHorizon iX - Screen Printer

DEK Galaxy - Screen Printer

Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence...

Printing

DEK Galaxy - Screen Printer

ProDEK Closed Loop

ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems,...

Inspection

ProDEK Closed Loop

DEK Under-Stencil Cleaning Fabric

DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it...

Cleaning Equipment

DEK Under-Stencil Cleaning Fabric

DEK Stinger - Onboard Dispense Module

Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who r...

Dispensing

DEK Stinger - Onboard Dispense Module

VectorGuard - Frameless Stencil Tensioning System

VectorGuard is a patented frameless stencil tensioning system offering significant advantages over conventional stencil technologies. Taking all the benefits of frame-mounted stencil systems, VectorGuard improves upon them and del...

Printing

VectorGuard - Frameless Stencil Tensioning System

Nano-ProTek - Stencil Coating

DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X incr...

Solder Paste Stencils

Nano-ProTek - Stencil Coating

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can b...

Printing

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

HawkEye® - High Speed Deposit Verification System

HawkEye is an automatic print verification technology that operates at the line beat rate. The system can be configured to assess 100% of printed boards and gives a rapid go/no-go indication for each, meaning that faulty boards can now be automati...

Printing

HawkEye®  - High Speed Deposit Verification System

Virtual Panel Tooling

Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substr...

Software

Virtual Panel Tooling

7 technical articles »

Stencil Printing Process Tools for Miniaturisation and High Yield Processing

Jun 12, 2023 | Clive Ashmore & Mark Whitmore

The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented....

NanoClear Coated Stencils

May 22, 2023 | DEK Engineered Products

Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield  Insufficient solder  Bridging  Solder balls on surface of PCB  Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost)  USC fabric (use "cheap" fabric to reduce cost)  Lint creates more defects  Cleaning chemistries (use IPA to reduce cost)  IPA breaks down flux and can create more defects...

Investigating the Metric 0201 Assembly Process

Dec 24, 2020 | Clive Ashmore

The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product....

Screen and Stencil Printing Processes for Wafer Backside Coating

Sep 09, 2009 | Mark Whitmore, Jeff Schake.

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers....

Fuel Cell Production Revs Up. The Paste Printing Platform And Process Has Other Uses, Too.

Dec 18, 2008 | Clive Ashmore, Global Applied Process Engineering Manager; DEK.

Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fossil fuel substitutes, but also because of potential economic benefit. Although fuel cell technology has been proven viable for various applications, the production costs still remain relatively high, and further process development to promote low-cost, high-volume manufacturing is required to reach a price point that encourages widespread consumer acceptance....

Lean, Mean Dual-Lane Machines

Dec 27, 2007 | DEK

The latest screen printing platforms unlock more of the potential from dual-lane processing. Simultaneous demands to enhance flexibility while increasing utilisation and overall throughput apply to manufacturers operating at virtually any point in the mix-volume continuum: capacity must work hard to deliver the required return. As these lean manufacturing principles hold sway from the US and Europe to the Far East, no modern assembler has a second to spare....

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Dec 13, 2007 | Steve Watkin, Semicon Packaging Technologies Division, and Tom Falcon, Future Technologies Group, DEK

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies....

145 news releases »

Smart Factory Check: how smart is your electronics production today?

Oct 05, 2017 | Interesting express benchmarking: at the Productronica, the world’s leading trade fair for electronics design and manufacturing in Munich, ASM invites show visitors to perform the innovative Smart Factory Check for a quick, smart analysis of their own production processes.

Smart Factory Check: how smart is your electronics production today?

Oct 05, 2017 | Interesting express benchmarking: at the Productronica, the world’s leading trade fair for electronics design and manufacturing in Munich, ASM invites show visitors to perform the innovative Smart Factory Check for a quick, smart analysis of their own production processes.

Don't miss! ASM @ SMTAi 2017

Sep 06, 2017 | Visit us at this year's SMTA International show in Rosemont, Illinois. On September 19 and 20 you can experience the latest ASM innovations for the Smart #1 SMT Factory "live" at Booth 1205.

Experience Unmatched Printing Knowledge and Future Technology Capability with DEK at APEX 2014

Feb 28, 2014 | tap into a knowledge base that spans nearly 50 years of printing technology innovation. As the market’s premiere materials deposition experts, the DEK team are uniquely qualified to help electronics manufacturing specialists develop customized printing solutions tailored to individual production requirements.

DEK Earns its Tenth Consecutive Service Excellence Award; Customers Consistently Impressed with Support

Mar 21, 2012 | At the APEX event held earlier this month, DEK proudly accepted its tenth consecutive Service Excellence Award,

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Feb 15, 2012 | In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Feb 15, 2012 | In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK. 

DEK signs contract with Ortana at Productronica 2011

Jan 20, 2012 | DEK has signed an agreement with global transport and public information solution provider, Ortana, for its Horizon 03iX printing platform. The order for the print platform was finalized at Productronica 2011 in Munich.

Indium Corporation snaps up DEK Horizon 01iX at Productronica 2011

Dec 21, 2011 | DEK has signed a contract with The Indium Corporation for its print platform, Horizon 01iX. The order for the print platform was finalised on the second day of Productronica 2011 in Munich.

DEK and Interlatin Take Productivity on Tour to Overwhelming Response

Dec 02, 2011 | Over the past month, DEK and its Mexican-based representative, Interlatin, have embarked on a Productivity Solutions Tour that has so far hosted four events in three cities and attracted nearly 150 customers. Setting up shop in Guadalajara, Monterrey, Tijuana and early next month in Ciudad Juarez, Mexico, the technology-rich Productivity Solutions Tour program is effectively enabling assembly specialists to get even more out of their print processes.

135 more news releases from ASM Assembly Systems (DEK) »

Thermal Interface Material Dispensing

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