Vantage - Advanced Dispensing for Precision Packaging and Assembly

Vantage - Advanced Dispensing for Precision Packaging and Assembly Description:

Our most advanced dispensing platform for electronics manufacturing

The Vantage® Series is specifically designed for high-end advanced semiconductor package, electromechanical, and printed circuit board assembly.

Create an unparalleled dispensing process with the ASYMTEK Vantage® Series, IntelliJet® Jetting System, and Canvas® software.

Product and component miniaturization pose unique challenges for the fluid dispensing process. Dispensing applications must deliver precise, consistent results within very small form factors. And to advance UPH goals, applications need to be fast. The Vantage Series provides all that and more with industry-leading precision, speed, and accuracy, making it a popular choice for advanced semiconductor packaging applications.

You’ll receive your new system with minimal lead time when you choose a standard system solution.

The Vantage Series:

• Jet into die-to-die gaps <200 μm.
• Avoid keep-out zones <250 μm.
• Dispense 49,000 DPH with a single IntelliJet valve.
• Dispense 90,000 DPH with two IntelliJet valves, an 84% increase in DPH over single-valve dispensing alone.
• Fast, repeatable setup with automated calibration.
• Advanced Canvas dispensing software.
• Patented* real-time correction for better wet dispense accuracy and yield.
• Closed-loop controls and data traceability keep your process on point.
• Industry 4.0 Connectivity Ready – Integrate Nordson dispensing equipment with your FIS or MES using the ASYMTEK NE Connect API and Software Developer Kit (SDK) standard in Canvas software.

*Nordson US Patents 9,707,584; 10,150,131; 10,737,286 and other patents pending.