Sniper III Split Vision Rework System
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Sniper III Split Vision Rework System |
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Sniper III Split Vision Rework System Description:
The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor the component, board and environment. A 17� monitor reflects the image of the bottom of the chip and the footprint on the board, these images are then adjusted to exactly overlay each other and the component placed automatically.
Energy Reflow
The Sniper III Vision Rework system combines Closed-Loop energy reflow control that precisely measures the temperature of the heated air and the very latest technology in optic alignment design. These features provide absolute control in positioning all ultrafine pitch, Micro BGA, QFP, and CSPs (Chip Scale Packages), together with large ceramic or plastic BGA devices.
Precision
Once aligned, the component is automatically positioned by pneumatic control, lifting the camera system clear of the placement vector. A Vertical Placement Drive (VPD) accurately orients the component to the contact land patten.
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Sniper III Split Vision Rework System was added in Jun 2006
Sniper III Split Vision Rework System has been viewed 274 times
