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MYDATA automation

 
MYDATA automation
 
SMT Assembly machines for high mix, medium-high volume and fast changeover production.
MYDATA automationSurface Mount Assembly machines for flexible medium-high volume, high mix electronic production and PCB assembly. Product line: Agilis feeder system, HYDRA Speedmount, MY19, MY15, MY12, MY9, TP9-2U. The placement machines provide a solid platform for mounting chip components, BGA, Flip Chip, Fine Pitch components & CSP.TP9-2U The TP9-2U is MYDATA�s entry-level machine for PCB production, mainly targeted towards companies specializing in short-series production. The TP9-2U is extremely flexible because it handles virtually any surface mount component in one placement machine. HYDRA Speedmount The HYDRA is an optional high speed mount head that can be added to a MYDATA machine. Placement rate can be increased to 21,000 CPH. Linescan Vision System (LVS) For high speed fine-pitch placement, the new LVS handles 6,100 fine-pitch components per hour. This dramatically increases production throughput and cuts cost per placement. A programmable lighting module allows full detection of all leads and bumps. LVS handles fine-pitch components up to 56 x 56 mm (2.2" x 2.2").

MYDATA automation Catalog
 
MY19 MY19 The largest placement machine from MYDATA is the MY19. Ideal assembly machine for high-volume and high-mix production. It combines speed (optional HYDRA Speedmount high speed head) and ultra-fine pitch/BGA capability with a medium to large feeder capacity
MY15 MY15 Ideal for high-volume and high-mix production for customers who don't need the large feeder capability of the MY19. MY15 combines speed optional (HYDRA Speedmount) and ultra-fine pitch/BGA capability with a medium to large feeder capacity.
MY12 MY12 Equipped with the HYDRA Speedmount head (21,000 CPH) in combination with the standard Z-fi head, the machine can perform both high speed mounting and fine pitch placement. In addition, the machine can place any common component.
MY500 � the SMT industry�s first jet printer MY500 � the SMT industry�s first jet printer Using a revolutionary new technology for solder paste application, the MY500 glides over PCBs printing solder paste at 500 dots per second. Because it needs no stencils, it offers many advantages over the standard screen printer � like more PCB design freedom and virtually no changeover or lead times.
  • Stencil free
  • High speed 1.8 million dots per hour.
  • Enables higher density of components on PCBs.
  • Virtually eliminates changeover and lead times.
  • Designed for fast changeovers and maximum uptime.
  • Complete off-line preparation.

For more information please visit our website


View MYDATA automation Catalog

MYDATA automation Postings
 
Recent News Items:

Jul 08, 2010 - Unparalleled machine utilization with MYDATA's PRM software and SMD Tower
Apr 30, 2010 - MYDATA – leader in innovation
Apr 12, 2010 - MYDATA announces Job Sequence Optimizer
Jan 13, 2010 - MYDATA certifies AIM leaded solder paste for jet printing
Jan 11, 2010 - MYDATA partners with new representative in Eastern Canada
Dec 17, 2009 - MYDATA announces Productronica 2009 Prize Winners
Dec 17, 2009 - MY500 Jet Printer wins 2009 Global Technology Award at Productronica
Nov 11, 2009 - How much time can you save in your SMT production?
Sep 26, 2009 - MYDATA has qualified solder paste from Alpha and AIM for Jet Printing
Apr 23, 2009 - MY500 Jet Printer wins SMT 2009 VISION Award

20 More News Items See all news

MYDATA automation Offices
 
MYDATA automation Main Office
Adolfsbergsvagen 11
BROMMA, STOCKHOLM , SE-168 66
Sweden
MYDATA automation Website
Email MYDATA automation
 
 
 






 
 
 
 
 
 
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