SMT Equipment

Reflow Soldering and Bonding Heads

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(4) products in the catalog

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Unitek Equipment

   

Reflow Soldering and Bonding Heads Description:

This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.

Reflow Soldering and Bonding Heads was added in Jan 2001

Reflow Soldering and Bonding Heads has been viewed 128 times

ICT Total SMT line Provider

Reflow Oven