VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels.
The MaxVIA, MaxVIA-Plus, and ModVIA systems deliver various plasma cleaning, surface activation, and adhesion improvement capabilities to suit through-hole and blin...
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Surface Finish |
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications.
The StratoSPHERE plasma system is ideal for wafer processing before typical ...
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Surface Finish |
FlexTRAK plasma treatment systems offer high-throughput, strip-type, and inline boat processing for advanced semiconductor packaging applications.
The FlexTRAK/FlexTRAK-S, FlexTRAK-CD/FlexTRAK-CDS, FlexTRAK-2MB, and FlexTRAK-SHS systems suit various plasma cleaning, surface activation, an...
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Surface Finish |
The MARCH AP Batch Series system offers high-performance plasma treatment for batch manufacturing and R&D environments.
The AP-300, AP-600, and AP-1000 plasma treatment systems suit various plasma cleaning, surface activation, and adhesion improvement applications. The systems deliv...
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Surface Finish |
VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels. The ModVIA is designed to process rigid and flexible PCB panels of various shapes and sizes for through-hole, blind via, etchback, and desmear applications
Industry-Leadi...
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Surface Finish |