Henkel Electronic Materials Products

SMT Products and Services offered by Henkel Electronic Materials

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Henkel Electronic Materials
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Henkel Electronic Materials Products

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads. »»

Headquarters: Irvine, California, USA

Manufacturer

13 listed by Henkel Electronic Materials

Product	Category
LOCTITE HF 212 Halogen-Free Solder Paste Solder Paste for Medium and Large Board Assemblies LOCTITE HF 212 solder paste is a halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste. LOCTITE HF 212 also shows excellent solderability when reflowed in both air and nitro...	Solder Materials
Henkel Encapsulants / Potting Compounds Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is the other critical component for product dur...	Materials
Henkel Surface Mount Adhesives As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) applications. Henkel offers a wide r...	Materials
MULTICORE Solder Fluxes With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-free, MULTICORE brand fluxes deliver...	Solder Materials
MULTICORE Solder Wires The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers ease of use and outstanding performance f...	Solder Materials
MULTICORE Solder Pastes As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as proven, traditional tin-lead formulations,...	Solder Materials
TECHNOMELT Adhesives - Low Pressure Molding Solutions Henkel's Technomelt products are engineering hotmelt adhesives for industrial applications in various market segments. Henkel's renowned TECHNOMELT low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The s...	Materials
Henkel Loctite Gaskets and Sealants Loctite silicone gasketing materials offer precise, reliable sealing for electronic enclosures, ensuring that housing modules are tightly secured and componentry is protected. Loctite silicone encapsulants are specially formulated to isolate sensitive fine-pitch leads from potential...	Materials
Henkel Conformal Coatings While Henkel is providing the leading materials used inside advanced packages and on sophisticated assemblies, we also deliver next-generation Loctite and Eccocoat brand conformal coating materials to ensure superior product protection. Many applications expose printed circuit boards (PCBs) to ha...	Coating Materials
Henkel Chip-on-Board (COB) Encapsulants Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire...	Materials
Henkel CSP and BGA Underfills Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance by redistributing stress away from the sold...	Materials
Henkel Electronics Assembly Film Adhesives The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple applications. Whe...	Materials
Henkel Assembly Paste Adhesives Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive dielectric materials, Henkel’s p...	Materials

Product

LOCTITE HF 212 Halogen-Free Solder Paste

Solder Paste for Medium and Large Board Assemblies LOCTITE HF 212 solder paste is a halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste. LOCTITE HF 212 also shows excellent solderability when reflowed in both air and nitro...

Solder Materials

Henkel Encapsulants / Potting Compounds

Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is the other critical component for product dur...

Materials

Henkel Surface Mount Adhesives

As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) applications. Henkel offers a wide r...

Materials

MULTICORE Solder Fluxes

With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-free, MULTICORE brand fluxes deliver...

Solder Materials

MULTICORE Solder Wires

The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers ease of use and outstanding performance f...

Solder Materials

MULTICORE Solder Pastes

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as proven, traditional tin-lead formulations,...

Solder Materials

TECHNOMELT Adhesives - Low Pressure Molding Solutions

Henkel's Technomelt products are engineering hotmelt adhesives for industrial applications in various market segments. Henkel's renowned TECHNOMELT low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The s...

Materials

Henkel Loctite Gaskets and Sealants

Loctite silicone gasketing materials offer precise, reliable sealing for electronic enclosures, ensuring that housing modules are tightly secured and componentry is protected. Loctite silicone encapsulants are specially formulated to isolate sensitive fine-pitch leads from potential...

Materials

Henkel Conformal Coatings

While Henkel is providing the leading materials used inside advanced packages and on sophisticated assemblies, we also deliver next-generation Loctite and Eccocoat brand conformal coating materials to ensure superior product protection. Many applications expose printed circuit boards (PCBs) to ha...

Coating Materials

Henkel Chip-on-Board (COB) Encapsulants

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire...

Materials

Henkel CSP and BGA Underfills

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance by redistributing stress away from the sold...

Materials

Henkel Electronics Assembly Film Adhesives

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple applications. Whe...

Materials

Henkel Assembly Paste Adhesives

Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive dielectric materials, Henkel’s p...

Materials