Electro-Comp Tape and Reel Services, LLC
Specializing in SMD, AX, & RAD component tape & reel packaging, Lead forming, baking and hot solder dipping.
Consultant / Service Provider, Manufacturer
Electro-Comp Tape and Reel Services has been providing innovative Tape & Reel Component Packaging Services to the Electronics Industry since 1987. As a leading provider of Tape and Reel Component packaging, we are committed to the advancement of Tape and Reel Packaging and maximizing the benefits of automatic placement equipment. Tape and Reel Packaging has provided to the electronics industry for over 50 years are now readily available for other applications. Component lead forming, tinning (hot solder dip), component baking, and QUP Packaging are just some of the services provided to support OEM and contract manufacturers. Our capabilities include high mix/low volume solutions as well as large volume production runs with automation capabilities.
Electro-Comp Tape and Reel Services, LLC Postings
2 products »
Electro-Comp supports a wide variety of customers including Original Component Manufacturers (OCM’s). Our automated axial lead orienting and taping capabilities gives component manufacturers the freedom to focus on component production while...
Capabilities include capacitors, resistors, thermistors, LEDs, TO92 transistors, TO220s. Orders can be processed with standard lead space configuration (increments of .100" or 2.54mm) or with custom or non-standard lead space configu...
1 technical article »
Methods Used In The Detection Of Counterfeit Electronic Components
Oct 04, 2022 | Harold "Woody" Hewett
In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing....
