SMT Equipment

FWF63502 Wafer 6.35mm 180°Vertical (DIP)

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FWF63502 Wafer 6.35mm 180°Vertical (DIP)

FWF63502 Wafer 6.35mm 180°Vertical (DIP)

Name:

FWF63502 Wafer 6.35mm 180°Vertical (DIP)

Category:

Components

Offered by:

Beijing Yuanda Innovation Technology Co., Ltd

   

FWF63502 Wafer 6.35mm 180°Vertical (DIP) Description:

Category
Category Wafer 180°Vertical (DIP)
Circuits 6
Pitch 6.35mm
Height 14.73mm
Electrical
Current Rating 10A AC(rms)
Voltage Rating 600V AC(rms)/DC
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

FWF63502 Wafer 6.35mm 180°Vertical (DIP) was added in Feb 2019

FWF63502 Wafer 6.35mm 180°Vertical (DIP) has been viewed 73 times

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