High Temperature Reflow Oven with Vacuum Situation for IGBT
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High Temperature Reflow Oven with Vacuum Situation for IGBT |
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High Temperature Reflow Oven with Vacuum Situation for IGBT Description:
High Temperature Reflow Oven with Vacuum Situation for IGBT KD-V20
Application :
IGBT module
MEMS
Large power modules package
Optoelectronic package
Hermetic Seals
Feature :
1. Viewing system: Cavity with a visual window, can observe the welding process in real time.
2. Up and down heating system : Equipped with current regulator,can control dynamic temperature with high accuracy respectively. It ensures the temperature of the bearing platform uniform.
3. Vacuum system :Equipped with direct connection high speed rotary vacuum pump, the charge vacuum can realize 1pa rapaidly .
4. Cooling system :Adopt water cooling system, ensure it can cooling rapidly in high temperature environment.
5. Software system :Raise or decrease temperature can be controlled by programming, it can set temperature up/down curve according to the technology. Each curve can generate automatically, programmable, can be modified and stored.
6. Control system :Software modular design can set the process curve independently, vacuum extraction, atmosphere, cooling, etc., and can be combined with the production process, to achieve a key operation.
7. Data recording system :With continuous real-time monitoring and data recording system, software curve records, temperature control curve saving, process parameters saving , equipment parameters records .
8. Rapid cooling rate :Independent water cooling and gas cooling device is set in the cavity, achieve rapid cooling of the device.
9. Low hole rate of welding quality :To ensure that after welding, a large area of the disc to achieve the following 3% hole rate.
10. The whole machine struture : econvenience for maintenance . The hearing parts maintain work and the Flux clean recycling work are done by one person easily .Replace the heating pipe only within 2 minutes .
11. Protection system: according to the many years experience in this field , multiple protection system customers can rest assured .
Technology data :
Basic data |
Outlook dimension |
900 x 800 x 1300 mm (LxWxH) Weight:about 200 kg |
Low vacuum |
1Pa |
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Welding area |
200x 160mm |
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Charge height |
100mm |
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Temperature range |
Highest can be up to 450°C |
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Temperature Warm-up rate |
Highest can be up to 120°C /min |
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Temperature Cooling rate |
≥120℃/min |
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Temperature uniformity |
±2% |
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Charge bearing |
5kW Bottom heating system |
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Heating platform |
Special handling heating platform |
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Power source standards |
380V, 50HZ/60HZ |
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Current |
.max. 3 x20 A, 50-60 HZ |
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Control parameters |
Controlling way |
Siemens PLC + IPC |
Monitoring window |
With visual window (1 set ) |
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Temperature curve setting |
Temperature & time (can set temperature /time/ warm-up rete,, 150 technical stages can be set at most ) |
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Joint |
COM |
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Option |
Welding vision inspection system |
※Optional with 50-200 magnification, observation, analysis of the welding process ※Software video recording function , convenience for the R&D and process analysis |
Security system |
Ultra high temperature alarm, excessive temperature raising alarm |
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System self-check function, each function is the normal state before production , the program allows operate |
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Cooling water pressure test system, low voltage alarm, software remind |
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One-click to cut off the heating part power supply |
High Temperature Reflow Oven with Vacuum Situation for IGBT was added in May 2017
High Temperature Reflow Oven with Vacuum Situation for IGBT has been viewed 749 times
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