DA 90 Die Attach Adhesive
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DA 90 Die Attach Adhesive |
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DA 90 Die Attach Adhesive Description:
DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dispense or printing method. It has demonstrated high reliability and high temperature reflow performance.
* Low Temperature Cure (90°C)
* Room Temperature Underfilling
DA 90 Die Attach Adhesive was added in Nov 2016
DA 90 Die Attach Adhesive has been viewed 595 times
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