high heat disipation performance ceramic pcb
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high heat disipation performance ceramic pcb |
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high heat disipation performance ceramic pcb Description:
基板类型：氮化铝陶瓷基板材料厚度：0.65mm导电层：Cu金属层厚度：75mm / 75mm表面处理：浸金单面/双面：双面镀铜通孔：是阻焊层：否
1。.精度高，电热性能好，插入强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本低于传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。
high heat disipation performance ceramic pcb was added in Mar 2021
high heat disipation performance ceramic pcb has been viewed 258 times
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