Durafuse™ LT - Low Temperature Solder Paste

Durafuse™ LT - Low Temperature Solder Paste Description:

Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low applications that are looking for a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and even performs better than SAC305 with optimum process setup. Durafuse LT:

• Provides a solution for heat-sensitive components and flex polymers
• Prevents thermal warpage of processor components and multilayer boards
• Meets low temperature requirements for step soldering, particularly in RF shield attachment and rework applications