Summary of Qualifications: |
• SMT and THT Soldering Process Optimization
• Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems.
• GSI Automatic Optical Inspection System
• 2D and 3D X-Ray Inspection Systems
• Reflow Oven Profiling using Datapaq, KIC and Supermole
• Lead Free Soldering Materials and Processes
• Alternative PWB Component Surface Finishes including Ni/Au, OSP Copper, etc.
• Paste in hole Soldering Processes
• Micro BGA Repair and Rework Processes
• PWB Design for Board Assembly Methodology
• Capital Equipment Acquisition from proposal through Evaluation, Final approval, Purchase and Implementation,
• Process Validation for Medical Device Manufacturing
• SPC Charting and Process Capability Analysis
• Hands on experience in Good Manufacturing Practices for Electronic Manufacturing of Medical Devices.
• Working Knowledge of ISO9000, QS9000, FMEA, DOE, IPC and Bellcore Standards.
• Working Knowledge of Microelectronic Packaging processes such as wire bonding, die attach, encapsulation.
|
