Thin Film Sputtering Engineer

Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager.

Responsibilities:

• Continuous improvement of sputtered thin film resistors to achieve capable, high yield processes with respect to sheet resistance and TCR. This includes establishing, developing and maintaining targeting operations (predictive and feedback adjustments) to achieve high yields.
• Continuous improvement of other sputter tools for various metal/conductor depositions.
• Establish and maintain process controls
• Take ownership of equipment including: preventative maintenance establishment/review, troubleshooting vacuum systems (roughing pumps and cyropumps), maintain documentation, and conduct operator/technician training to assure efficient, high yield operation with minimal downtime.

Other Responsibilities:

• Assist/direct efforts to improve Nitride/Oxide deposition, annealing, and heat treat operations.
• Develop new sputtered film capability as required from the Business Unit.
• Work as the leader or member of a team effort to improve operations outside and within the area of primary responsibility as required.
• Conduct Failure Analysis and complete root cause corrective actions as required (both from an internal and external customer perspective).
• Manage assigned projects/tasks related to capability improvement, cost reduction, equipment justification/specification, qualification of new materials, and environmental compliance.
• Any other duty assigned by management.

Education/Requirements:

• Green Belt or Black Belt Certification, or demonstrated expertise in statistical analysis
• Proficiency in Microsoft Office, Minitab, AutoCad and Design-Ease software
• Programming: Visual Basic, Visual C++, Labview/Testpoint, Ladder Logic
• Minimum B.S. in Engineering or Physical Science with 5-10 years sputter experience or M.S. with 3 to 5 years of experience in sputtering.