SMT engineer

Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowledge or a willingness to learn machine programming involved in die attachment and wire bonding. This is a contract assignment which will be a minimum of 2 months long and could definitely go longer. Contact Shawn Rutledge at 1-877-916-5420 ext 1105 for more details.