Risk Analysis in Electronic Assemblies

To avoid malfunctions of electrical assemblies in the field a proper risk assesment identifying potential failure sources in choosen manufacturing materials/processes & product design becomes more and more important. This presentation will give each delegate a brief overview on main risk sources and introduces meaningful examination methods for Validation vs. Process Monitoring. Practical applicability of the introduced topics will be demonstrated on a field case.

Topics included:

• Differentiation of risk & failure analysis
• Why becomes Risk analysis more and more important
• Risk of hygroscopic/ionic substances & particle contamination
• Analytic Methods for Risk assessment (focus on evaluation of Ionic Contamination and Technical Cleanliness)
• Special risk on RF assemblies?
• Case Study: Evaluation of Bondability on ENEPIG surfaces
• Forecast and Perspectives