SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Two 90 minute Sessions, June 14 and 15, 2018 1:00pm to 2:30pm Eastern

Presented by:  S. Manian Ramkurar, Ph.D., Center for Electronics Manufacturing and Assembly

This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging.

Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues.

Who Should Attend:

• People with very little or no background in SMT
• Process, Design, Test and Quality Engineers
• Process and Quality Technicians
• Operators
• Marketing, Sales and Purchasing Staff
• Managers

After completing this course, you will be able to:

• Identify various SMT components, their terminology and nomenclature
• Understand what a PCB is and also the need for effective thermal management
• Identify types of mixed technology PCB assemblies and their assembly sequence
• Understand the influence of design on the ease of manufacturing and assembly
• Understand thoroughly the entire assembly process and the various parameters that influence it.
• Understand the influence of various materials such as solder paste, adhesives, flux, etc.
• Detect assembly process defects and troubleshoot them.
• Evaluate equipment required for setting up assembly lines
• Understand Lead Free Implementation and Issues.