Temperature Profiling & Reflow for Lead-Free Webinar 14.30GMT

The presentation provides a better understanding of solder paste reflow soldering in modern manufacture. Only the correct selection of solder paste and reflow parameters along with a correctly designed assembly can provide reliable solder joints.

The course aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of reflow. The key feature of the course focuses on how to correctly profile a printed board assembly with convection and vapour phase and demostrating the tricks of the trade and the pitfalls of poor profiling

Presented by Bob Willis

PCB assembly processes requiring profiling Selecting the correct thermocouple Mounting thermocouples Measuring systems Impact of design on profiling Component type and thermal demand Temperature profiles for adhesives, soldering & curing Process defects associated with incorrect profiling