CALCE/IPC Joint JISSO Seminar on Advanced Interconnection Solutions

This seminar will provide attendees with knowledge of the latest trends and technologies in electronics manufacturing. CALCE, IPC, and Members of the Jisso International Council will also be speaking on reliability, prognostics, and three-dimensional interconnections.

JISSO Seminar Topics:

• Role of Prognostics and Health Management in Electronics
• Total Packaging Solutions and JISSO Interconnection Levels
• Electronics Materials Status - 2011
• Electronics Reliability Needs and Test Methods - 2011
• Solderless Interconnection
• Printed Electronics
• Environmentally Restricted Materials
• Sustainability in Electronics Manufacturing

Attendees will get a snapshot view of integrated electronics development and manufacturing, and will gain valuable knowledge on technologies that will impact the electronics industry over the next decade. If you want to gain a comprehensive understanding of the key issues in electronic interconnections, this seminar is a must.

What is JIC?

The purpose of the Jisso International Council is to facilitate, coordinate, and promote the orderly implementation of advanced electronic packaging and other advanced technologies by standardization and other means. The Council is supported by three main regional groups in each of three global hemispheres. These are the Jisso Japan Council (sponsored by JEITA, JPCA), the Jisso North American Council (sponsored by IPC, JEDEC, and iNEMI), and the Jisso European Council (sponsored by the EIPC).