IMAPS 2017 - 50th International Symposium on Microelectronics

Category

Conferences

Date:

Mon, October 09 - Thu, October 12, 2017

Location:

Raleigh, North Carolina

Description:

The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2017 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks that span the three days of sessions on: CHIP PACKAGING INTERACTIONS (CPI); HIGH PERFORMANCE, RELIABILITY, & SECURITY; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED PACKAGING & SYSTEM INTEGRATION; ADVANCED MATERIALS & PROCESSES; as well as the Interactive Poster Session.

Url:

http://www.imaps.org/imaps2017/index.htm

PCB 3D AOI

Smart Factory Starter Kit - KIC

var anUrl = "/fusionreactor/UEM.cfm?db=320&wr=197&s=55EC3D73731697C6A056C547B5C6E5AC&t=107276174";document.write(unescape("%3Cscript src='/fusionreactor/UEMJS.cfm' type='text/javascript'%3E%3C/script%3E"));