IMAPS 2017 - 50th International Symposium on Microelectronics

Category

Conferences

Date:

Mon, October 09 - Thu, October 12, 2017

Location:

Raleigh, North Carolina

Description:

The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2017 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks that span the three days of sessions on: CHIP PACKAGING INTERACTIONS (CPI); HIGH PERFORMANCE, RELIABILITY, & SECURITY; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED PACKAGING & SYSTEM INTEGRATION; ADVANCED MATERIALS & PROCESSES; as well as the Interactive Poster Session.

Url:

http://www.imaps.org/imaps2017/index.htm

Jul 17, 2018

Online

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Jul 26, 2018

Online

Cleaning for Reliability - Overcoming Challenges for Class III Assemblies - Online Webinar

ZESTRON Americas

Sep 05, 2018

Taipei, Taiwan

Semicon Taiwan

Clariant Cargo & Device Protection

Sep 13, 2018

Des Plaines, IL

IPC E-Textiles 2018

Association Connecting Electronics Industries (IPC)

Jul 26, 2018

Online

Electronics Cooling Fundamentals (The Basics of Electronics Cooling)

Advanced Thermal Solutions, Inc

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