SMTA China East Conference 2018

The SMTA China will organize the SMTA China East Conference 2018 in Shanghai on 23-26 April, 2018. This timely event will be held in conjunction with NEPCON China 2018. This events will as usual address the industry’s most pressing issues in advanced packaging/components, Assembly, Business/Supply Chain, Emerging Technologies, Harsh Environment Applications (Military, Aerospace, Automotive, Industrial, Oil & Gas), PCB Technology, Process Control.

Topical coverage includes:

Advanced Packaging/Components:

2.5/3D Packaging and Integration, BGA/CSP,Biomedical Packaging,Component Storage,Connector Technology,Copper Pillars,Copper Wire Bonding,Diffusion Bonding,Embedded and Miniature Passives,Environmental Testing,Failure Analysis Techniques,Flip Chip,High Temperature Packaging,Lead Finishes,Magnetic Soldering,MEMS and Sensors,Moisture Sensitive Devices (MSD),Package on Package (PoP),Photonics,Photovoltaics and Solar,Reliability,Silver Wire-bonding,Stacked Die,System in Package (SiP),Through Silicon Vias (TSVs),Tin Whiskers,Wafer Level Packaging (WLP) .

Assembly:

3D Board Assembly,Additive Manufacturing,Adhesive Dispensing,Adhesive Electrically Conductive,Adhesive SMT,Cavity Board Assembly,Cleaning Aqueous,Cleaning Ion Chromatography,Cleaning Resistivity of Solvent Extract,Cleaning Vapor Degreasing,Component Traceability,Design of Experiments ,DFX/Design for Six Sigma,Epoxy Electrically Conductive,Head on Pillow Defect/Warpage Induced Solder Joint Defects,Interconnections Solder,Interconnections Solderless,Low Temperature Processing,Placement 01005 / 03015 Components,Placement BGA/ CSP,Placement Chip Attach to PCB (DCA) ,Placement Leadless Area Array Packages,Placement Package-on-Package,Protection Conformal Coating,Protection Low Pressure Molding,Protection Potting,Reflow Pressure Soldering,Reflow Soldering Formic Acid Vapor,Reflow Vacuum Soldering,Reflow Vapor Phase,Rework and Repair of QFNs (01005),Leadless Components, PoP,Rework Reliability),Solder Paste Jetting,Solder Paste Printing,Solder Paste Stencils,Solder Voiding,Soldering Laser,Soldering Robotic,Soldering Selective,Soldering Wave,Thermo Compression Bonding,Under_ll Dispensing,Under_ll/ Corner Glue/ Other,Polymeric Reinforcements,Underfill/ Corner Glue/ Other Polymeric Reinforcements .

Business/Supply Chain:

Capacity Modeling,Conict Minerals,Contract Manufacturing,Counterfeit Parts,Doing Business in Overseas,Environmental Issues,Lean Manufacturing,Onshoring,Operations Management,Part Obsolescence,RoHS/REACH Compliance,Supplier Management,Technology Roadmaps .

Emerging Technologies:

≤0.3mmPitch Area Array Technologies,3D Circuits,3DPrinting & Design Rules,Advanced Packaging,Alternate Solder Alloys,Assembly to Flex Substrates,Assembly to Glass Substrates,Cavity Assembly,Consumer Applications,Embedded Active Technology,Embedded Passive Technology,Flexible Electronics,Halogen and Halogen-Free,High Frequency,Jetting of Solder Pastes,LED Technology/Assembly/Reliability,MEMS/RF/MOEMS,Microsystems Packaging / Modular Microsystems,Nanomaterials,Nanotechnology, Materials, & Electronics,New Materials and Processes,Reliability of Nanodevices,Resin Reinforcement Solder Pastes,Sensors and Manufacturing,Smart Manufacturing Systems,Optoelectronics,Plastic 3D PCB to PCB Technology,Power or Thermal Management,Power Electronics,Printed Electronics Technology,Small Die Size Singulation,Solid State Lighting,Solar Technology,System in a Package,Thermal Interface Materials,Touch Screen Technologies,Virtual Prototyping,Wearable Electronics,Wireless Applications .

Harsh Environment Applications (Military, Aerospace, Automotive, Industrial, Oil & Gas):

Alternate Energy,Battery Prognostics,Components and Reliability,Copper Corrosion,COTS,High Lead Solder Replacement,High Melting Point Solder,High Temperature Electronics,Lead-free Issues,Non-Destructive Inspection,Micro-Computed Tomography,Multiphysics Modeling,Substrates and Finishes,Thermal Management,Tin Whiskers .

PCB Technology:

Bio-Compatible Substrates,Black Pad and Surface Finish Defects,Conductive Anodic Filament (CAF),Creep Corrosion,Embedded Passive/Active Components,Halogen Free,HDI,High Power PCBs,Micro-vias (including filled/unfilled),Moisture Sensitivity,New Laminate Materials,New Surface Finishes & Solderability,Pad Cratering,Soldermask,Substrate Reliability.

Process Control:

Acoustic Imaging (C-SAM),Bene-ts of AOI & SPI,CIM,In-Circuit Test,Process Modeling,Software,Test Strategies,Yield Improvement,2D/3D X-Ray .