PCB Pad Cratering Failures, Test Methods - Causes & Cures Webinar

The separation of copper pads from the surface of printed boards is not a new failure but mechanical failure or pad cratering in the epoxy or glass layer is new. Many people have seen this type of defect since the introduction of lead-free assembly and blamed the high process temperatures but that is not the complete story on this difficult to find failure mode.

One person or a group of people can attend from your company site

Topics Covered:

• Common Failure Modes
• Copper Pad Separation
• Design Rules to Reduce Pad Lift
• Impact on Laminate Types
• Testing Pad & Ball Adhesion
• Inspection Techniques

Presented by Bob Willis. UK Time:14:30

The webinar lasts between 60-90min with questions and answer session