Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial

The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications.

Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included.

Who Should Attend:

• Process, Design, Test and Quality Engineers
• Process and Quality Technicians
• Operators
• Managers

After completing this course, you will be able to:

• Understand the stencil printing process and the process parameters, thoroughly.
• Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
• Evaluate materials such as paste, stencil and squeegee for efficient printing
• Understand the various solder paste constituents and types of paste
• Specify stencils, solder paste and printer requirements for various applications
• Understand Stencil construction and features for efficient paste transfer
• Understand squeegees and the recent advances in print technology
• Evaluate in-coming raw materials and procedure for qualifying vendors
• Understand the print process for adhesive applications