Huge 2-Day Auction, Former Assets of Hei, Inc. Late Model SMT/LED Component Package & Assembly Equipment - Complete Production Line

Assets To Include: 

• Over $1,500,000 In Inventory & Customer Lists Available
• Kulicke & Soffa ICONN Wire Bonder
• Datacon APM Die Bonders
• Ekra X4 & X5 Screen Printers
• Disco DAD3350 Dicing Saw
• MyData My Series Chip Placement Systems
• YES Plasma Etchers
• Reflow Ovens
• Temperature & Humidity Chambers
• Epoxy Dispense Systems
• Wafer Grinders & Polishers
• Test & Measurement Equipment
• Lab Support
• Large Quantity Of High End Microscopes
• Quality Assurance
• Spare Parts
• & Much, Much More...

About HEI:

The Microelectronic Assembly Operation Offers High Density, Direct Chip Attach Miniaturization Solutions, Including Services From Front End Development Through Full Production; Flex, Rigid-Flex And Ceramic Substrates, Which Are Used As Platforms For Microelectronic Assembly; Engineering Services For Creative Technological Solutions; Lean Flow Manufacturing; The Ability To Develop And Implement A Range Of Test Software And Hardware Solutions.