BTU International
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
BTU HAS BEEN A LEADER IN IN-LINE THERMAL PROCESSING FOR OVER A HALF A CENTURY.
BTU’s products excel in processes where precise control of atmosphere and temperature are critical to product yield. With over 10,000 units shipped, service and support in over 30 countries, and manufacturing facilities on two continents BTU is the leading choice for global manufacturers.
PLATFORMS
The World’s Best Performing Reflow Ovens
Pyramax OvensBTU’s Pyramax family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features BTU’s exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications Pyramax can provide O2 levels as low as 2ppm above source in the peak reflow zone.
Custom Furnaces: Made in the USA
BTU’s Controlled Atmosphere Furnace has the industry’s lowest Cost of Ownership and features process temperatures up to 1180°C. BTU’s automated thermal controls utilize segmented heaters to optimize thermal performance resulting in thermal uniformity better than +/-2°C. The system also features flexible atmosphere with Argon, Hydrogen, Nitrogen or forming gas available.
BTU International Postings
4 products »
NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS Easy process transfer Low maintenance, no vacuum pump &l...
PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven
Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual cham...
5 technical articles »
Operation of a Vacuum Reflow Oven with Void Reduction Data
Apr 21, 2021 | Fred Dimock
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....
Thermal Profiles - Why Getting Them Right is Important
Oct 24, 2019 | Fred Dimock
Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control...
Lead-Free Solder Wafer Bumping
Dec 06, 2007 | Fred Dimock, Kristen Mattson.
Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....
Making A Case for Continuous Furnaces
Nov 08, 2007 | Fred Dimock
A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....
Maximizing Process Control with Controlled Convection Rates
Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.
Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....
347 news releases »
BTU International's Aurora 200N Takes Home 2025 Global Technology Award for Reflow Innovation
Nov 24, 2025 | BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that its Aurora 200N Reflow Oven has been honored with a 2025 Global Technology Award in the category of Soldering Equipment – Reflow. The award was presented during a ceremony at productronica in Munich, Germany, on Tuesday, November 18, 2025.
Nov 03, 2025 | BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company's Pyramax™ and Aurora™ reflow ovens. The award was presented on October 28th during NEPCON Asia 2025 in Shenzhen, China.
BTU International Brings High-Performance, Energy-Efficient Reflow Solutions to productronica 2025
Oct 27, 2025 | BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at productronica 2025, taking place November 18-21 at Messe München in Munich, Germany. Visitors can find BTU at Hall A3, Stand 103, where the company will showcase its newest model, the Aurora 125N.
Oct 27, 2025 | BTU International, a leading global supplier of advanced thermal processing equipment for electronics assembly, today announced plans to expand its manufacturing operations into Singapore. This strategic expansion is designed to mitigate risk, reduce tariff exposure, and enable BTU's Shanghai facility to increase production and add new product lines for non-tariff-restricted markets.
BTU International to Share Reflow Technology and Process Innovations at SMTAI 2025
Sep 24, 2025 | BTU International, Inc. is pleased to announce its participation in SMTA International 2025, taking place October 21–23 at the Donald E. Stephens Convention Center in Rosemont, Illinois. At Booth #2927, BTU representatives will be available to discuss the company's 75 years of reflow innovation and how its solutions continue to evolve to meet today's manufacturing challenges.
BTU International's Aurora 200N Sets the Pace, Wins 2025 Mexico Technology Award for Reflow
Sep 24, 2025 | BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been honored with a 2025 Mexico Technology Award in the category of Soldering Equipment – Reflow for its Aurora 200N Reflow Oven. The award was presented at SMTA Guadalajara, recognizing innovations that enhance manufacturing performance across the electronics industry in Mexico.
Smarter Reflow Starts Here: BTU Brings the Aurora 175N to NEPCON China 2025
Apr 21, 2025 | BTU International, Inc. will feature its next-generation Aurora 175N reflow oven in Booth 1E50 at NEPCON China 2025, taking place April 24–26 at the Shanghai World Expo Exhibition & Convention Center.
BTU International to Discuss the Aurora Line of Solder Reflow Ovens at the SMTA Capital Expo
Apr 14, 2025 | BTU International, Inc. will exhibit at the SMTA Capital Expo & Tech Forum on May 8, 2025, in Arlington, Virginia. At the event, BTU will highlight its Aurora reflow oven platform, showcasing the latest innovations in precision thermal processing and energy efficiency.
BTU International to Present Webinar on Solder Reflow Oven Fundamentals and Thermal Profiling
Apr 08, 2025 | BTU International, Inc. is pleased to announce an exclusive webinar, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches, hosted by E-Tronix, BTU's representative. This in-depth session, presented by Bob Bouchard, will equip SMT engineers, process managers, and production supervisors with the knowledge and tools to optimize their reflow processes for maximum yield and reliability.
BTU to Highlight Pyramax TrueFlat Warpage-Free Reflow Technology at Semicon China
Mar 24, 2025 | BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced its participation at SEMICON China 2025, taking place March 26-28, 2025 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China. Visitors are invited to visit booth E7-7201, hosted by BTU representative CohPros International, to learn more about the innovative Pyramax™ TrueFlat™ convection reflow oven, the industry's leading solution for eliminating substrate warpage in semiconductor packaging applications.
