SMT adhesive printing

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I have a question regarding post cured property of SMT adhes... - Dec 14, 2004 by Peter

yes,it maybe lead to test failure,because solder joint is ba... - Dec 15, 2004 by huangfox

All of the SMT adhesives that I have used are non-conductive... - Dec 15, 2004 by RDR

Check IPC-A-610C Chapter 12.1, Staking Adhesive ... - Dec 15, 2004 by

Peter

#31712

SMT adhesive printing | 14 December, 2004

I have a question regarding post cured property of SMT adhesive.

If after component placement, the epoxy dot gets compressed and bridges between the 2 pads, what would the impact on the circuitry? Would it pose risk for flux entrapment? Could the cured epoxy introduce any impedance to the circuit and lead to test failure?

Rgds, Peter

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huangfox

#31720

SMT adhesive printing | 15 December, 2004

yes,it maybe lead to test failure,because solder joint is bad

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RDR

#31728

SMT adhesive printing | 15 December, 2004

All of the SMT adhesives that I have used are non-conductive by themselves. I assume that the solder joints are formed by wave soldering?

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