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Hi I'm trying to plot a LSP profile to reduce void. But ... - Jun 06, 2004 by

So what is LSP? ... - Jun 06, 2004 by RDR

Hi Russ I happen to come across a article about reflow pr... - Jun 07, 2004 by

LSP is 'Long Soak Profile'. See ... - Jun 07, 2004 by Mark Stansfield

ADM, just click on my name and it will give you the E-Mail. ... - Jun 07, 2004 by RDR

First, voiding is a process indicator. Next, as you say, th... - Jun 07, 2004 by davef

Me too. Check out this months Circuits Assembly. Dage has ... - Jun 07, 2004 by

Hi Russ I can't get your email address. I'm not a registe... - Jun 08, 2004 by

adm

#28975

LSP profile | 6 June, 2004

I'm trying to plot a LSP profile to reduce void. But I do not have much info about LSP. Does anyone know what are the specific times and temperature of the LSP profile?

And are there any ways to eliminate solder void other than changing profile?

Rgds

reply »

adm

#28976

LSP profile | 6 June, 2004

I'm trying to plot a LSP profile to reduce void. But I do not have much info about LSP. Does anyone know what are the specific times and temperature of the LSP profile?

And are there any ways to eliminate solder void other than changing profile?

Rgds

reply »

RDR

#28977

LSP profile | 6 June, 2004

So what is LSP?

reply »

adm

#28988

LSP profile | 7 June, 2004

Hi Russ

I happen to come across a article about reflow profile. Other than Ramp-to-spike(RTS) & Ramp-soak-spike(RSS), its introduce a new reflow profile & call it LSP.

Is it possible to give me your email address & I will send the article to you?

Rgds

reply »

Mark Stansfield

#28999

LSP profile | 7 June, 2004

LSP is 'Long Soak Profile'. See http://www.aimsolder.com/tds/NC_297DX_Sn62_&_Sn63_Solder_Paste.pdf

Looks like a variation of the RSS, with you guessed it a longer soak.

reply »

RDR

#29001

LSP profile | 7 June, 2004

ADM, just click on my name and it will give you the E-Mail. I would like to see it. I am currently going the other way with my profiles and almost exclusively using the RTS profiles.

Russ

reply »

davef

#29004

LSP profile | 7 June, 2004

First, voiding is a process indicator. Next, as you say, the profile is a significant contributor to void formation. Finally, when considering the "material factors" that drive void formation, solder paste formulation is the most critical.

Discussing voids is one THE most favorite topics here at SMTnet. Search the fine SMTnet Archives for additional views.

reply »

Ken

#29006

LSP profile | 7 June, 2004

Me too. Check out this months Circuits Assembly. Dage has an interesting article about voiding as a function of surface plating....

reply »

adm

#29016

LSP profile | 8 June, 2004

Hi Russ

I can't get your email address. I'm not a registered user.