Hi,
Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into a 64sec. This reflow adjustment helped solve the unsolder issues. (night shift).
Unfortunately, the next day (morning shift), we found white coloured "spider-web" looking flux stains on the solder joints. The supplier attributed the web flux stains to our high reflow time and the small pcba size. The stains look like a spider-web, as it has "bubbles" occuring during the high reflow time; and it only readily visible under 30x scope magnification, scope inspection dictated by the customer...
We tried using IPA, prozone, and 60-80(deg-C) hot water to brush the white flux stains. All these efforts only helped to reduce some of the flux stains...
Anyone have some recommended flux stain removers, for us to further try this "polish touchup" of the flux stains? Or anyone have experience in similar issue, and managed to get customer conditional acceptance on such flux stains?
In advance, Everyone's experience shared and engineering advice, on this migraine, is greatly appreciated, Thanks!
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