| Reading some technical report I found the term "CSP", but no explanation. | I guess something about Chip Scale Package... but not sure. | Could someone please explain it to me? | Rgds, | Anderson You are absolutely correct. CSP is an acronym for Chip Scale Package. There are some disputes about the description of a CSP, but the most popular description is that a CSP must be no more than 120% the X and Y dimensions of the silicon die within the package. The CSP is then a die on a carrier substrate. In order to maintain the CSP die to package ratio the CPS is generally a ball grid array. The CSP then can be machine placed onto a PCA. The CSP is not to be confused with a COB (Chip on Board) or Flip Chip. Someone might confirm this, but I believe the term "Micro BGA" has been patented by Intel, thus the term CSP has been used much more. Obviously a great deal of the Micro BGA (fine pitch BGAs) do not fall under the CSP description Steve A
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