THE ANSWER FOR MR. EARL MOON

HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED BY T.C;UNDER THE BGA BODY) ��IRON TIP TEMP : 350-370��(MEASURED) ��REBALLING : ASSEMBLED PROFILE(SAME MODEL;OVER 200��:35SEC) WE USED REFLOW MACHINE ��SOLDERING HAET: SAME WITH DESOLDERING PROFILE

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| HI Earl | Thank you for your answer. | Let me know you about the hot you mentioned | First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) | ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED BY T.C;UNDER THE BGA BODY) | ��IRON TIP TEMP : 350-370��(MEASURED) | ��REBALLING : ASSEMBLED PROFILE(SAME MODEL;OVER 200��:35SEC) | WE USED REFLOW MACHINE | ��SOLDERING HAET: SAME WITH DESOLDERING PROFILE | I've not done it as you though appreciate your answer. I think my question was based more on how you know what the failure actually was. I mean, did the failure occur at the ball attachment site or inside the device.

PBGA's are essentially PCB substrates capable of first being damaged like most all PCB's. They often fail at the attachment site as lifted or separated lands. Internally, they may fail as separated traces or where die attachment "wires" fail at their attachment points/pads or die attachment sites.

Can you find the point of failure using destructive and/or X-Ray techniques? If so, you may determine the failure mechanism as too much heat too long or?

Let us all know,

Earl Moon

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