Switching from full-rosin/RMA flux to no-clean flux

I got an inquiry from one of our electronics labs with regards to their soldering processes. They use eutectic (63% Sn, 37% Pb) solder. For liquid flux they are currently using Kester 186, which is an old-school, full rosin (RMA and ROL1) flux that contains 36% solids. For solder wire they are using Kester 282, which contains RMA/ROL1 flux paste in the core.

They are now thinking of switching to a "no clean" flux for both liquid and solder wire. What are the pros and cons to switching to a "no clean" flux? Will the solder junctions be just as good? Will they have to change their soldering processes? Will they have to change their cleaning processes?

Thank you

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