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Qustion regarding solderability for PCB in Reflow

Views: 953

#87094

Qustion regarding solderability for PCB in Reflow | 22 September, 2021

Hi Forum.

Is there anyone who can tell if an empty PCB with no SMD components mounted and HAL surface will get a less solderability after been running through reflow (convection).

Eg. when testing empty PCB with temperture data logger.

Regards Ole

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#87095

Qustion regarding solderability for PCB in Reflow | 22 September, 2021

Excessive baking can actually lead to oxidation and create solderability issues. Why would you profile with empty board? But even if you do that, better use solder sample board.

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#87106

Qustion regarding solderability for PCB in Reflow | 23 September, 2021

Hi Evtimov Thank you for a quick reply for my question :-)

The reason why I am using an empty board is only to have a place for the temperture logger beside the fully mounted SMD board that is monitoring the reflow-profil and also to get the same conveyor with through the rewlow.

However this is not the best way to do it.

Reg. Ole

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#87107

Qustion regarding solderability for PCB in Reflow | 23 September, 2021

This means that the board is not heated to liquid.

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#87207

Qustion regarding solderability for PCB in Reflow | 21 October, 2021

Ive done this before and it seemed fine for me although id didnt bake it more than twice.

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#87209

Qustion regarding solderability for PCB in Reflow | 21 October, 2021

Hi all.

Thank you for all your replies ang help for my request

Best Regards Ole

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