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repair the BGA/CSP device

repair the BGA/CSP device

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We are preparing a batch of samples for test. several IC whi... - Jul 13, 2001 by qinongzhu

You will need to prepare the component and site for rework. ... - Jul 13, 2001 by CAL

Cal is right on target. I'll expand on his points. BGA s... - Jul 14, 2001 by davef

There is a equipment brand : Martin is capable to do you wan... - Jul 15, 2001 by Ricky C.

What would be the best method for attaching the balls, when ... - Aug 10, 2001 by Yngwie

Be very careful how you perform the removal process if you w... - Aug 13, 2001 by fmonette

qinongzhu

#7246

repair the BGA/CSP device | 13 July, 2001

We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and can plant new solder balls. Therefore, we can use these board again. I know this process may affect the performance of IC, however, we really need them.

Help!

Thank a lot!

qinong

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CAL

#7249

repair the BGA/CSP device | 13 July, 2001

You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing kit.http://www.winslowautomation.com/index.html. Manncorp also has a good reballing fixture with one of there rework station.

Best regards

Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org

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davef

#7252

repair the BGA/CSP device | 14 July, 2001

Cal is right on target. I'll expand on his points.

BGA solder perform suppliers: * Winslow Automation: http://www.winslowautomation.com/ * Galahad 12784 Tulipwood Circle Boca Raton, FL 33428 561-487-0271 galahad.inc@usa.netemail: BGAKIT@concentric.net * Weller http://www.coopertools.com

Reballing training kit using Solderquick: http://www.emulation.com/reball/ http://www.intertronics.co.uk/products/cwaisq.htm [this one is neat cuz it has pix] Weller reballing kit: http://www.practicalcomponents.com/tools_supplies_training/wellerbga.htm

BGA Reballing Services: * Accurel http://www.accurel.com/qkturn/quikdata.htm * PSI, 16833 FM 1431 #E3, Leander TX 78641 512.267.3143 fax4619 Steve Stach * Six Sigma 408-526-1350 * NETCO Automation Rich Breault * XeTel 2105 Gracy Farms Lane Austin, TX 78758 512-435-1000 Fax: 512-834-9250 http://www.xetel.com

We appreciate the economics of your desire to rework these components. Many feel that way. Motorola, for one, takes a contrary position. They do not ship reused BGA. See the following thread for a little more detail [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&&Message_ID=7099&_#Message7099]. Their position is well documented on their site.

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Ricky C.

#7255

repair the BGA/CSP device | 15 July, 2001

There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it.

Bye

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Ricky C.

#7257

repair the BGA/CSP device | 15 July, 2001

There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it.

Bye Chng LK

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Ricky C.

#7258

repair the BGA/CSP device | 15 July, 2001

There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it.

Bye Chng LK

reply »

Yngwie

#17179

repair the BGA/CSP device | 10 August, 2001

What would be the best method for attaching the balls, when doing BGA rework. I Found that by using the solder paste, it will give us better rework yield vs using the paste flux ? My data was collected from a very small experiment and hard to conclude that. Is that "luck" or what ? Any experience ?

cheers.. nifhail

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fmonette

#17184

repair the BGA/CSP device | 13 August, 2001

Be very careful how you perform the removal process if you want to re-use BGA/CSP devices.

As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture prior to reflow the rapid evaporation at high temperature will create internal cracks and delaminations. These are latent defects that will create early life failures in the field.

This concern is also valid for localized hot air reflow and re-balling, whenever the body temperature of the components exceed 200C. To avoid damaging the components during the removal process it is mandatory to completely remove the moisture by baking them at a lower temperature. This means that the whole board must be baked prior to rework. The proper guidelines for reworking moisture sensitive components are clearly documented in J-STD-033. An upcoming revision will include a bake cycle at 90C for populated boards. The duration varies from 17 hours to 16 days, based on the sensitivity level and body thicknes of the MS components to be removed.

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