Package on Package ( TI: OMAP3503DCBC)

I have been trying to get the profile right for this part(OMAP3503DCBC) , but still struggle. I'm using the Herller 1809 MKIII oven. I look at the profile recomended by TI and still issue with the solder ball collaps and wetting. My peak temp @256.C Reflow @85s Soak @115s. If anyone has a profile please summit, and i will try it out. Preferred 9 zone oven. Thanks.

-Sai

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