Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower than gold. At least now it is. Cost is about 30% less than that of thick wirebondable gold because ENEPIG uses thinner gold and plating process is easier. In addition, ENEPIG does not cause gold embrittlement in SMT soldering. Anyway, I have tested it and ENEPIG appears to work great.
Anyone using it and anyone have any problems with it?
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