Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

paste release

Views: 3024

Hi! i would like to have opinion about the solder paste rel... - Feb 05, 2010 by DenP  

The ratio of aperture opening area to aperture wall area is ... - Feb 07, 2010 by davef  


DenP

#61048

paste release | 5 February, 2010

Hi! i would like to have opinion about the solder paste release. is it better on a 5mil or 6 mil thickness stencil? thank you!

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davef

#61062

paste release | 7 February, 2010

The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.

reply »

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