Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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We have started using QFN packages in large volume and are h... - Nov 09, 2007 by devajj
What is the real problem? No-solder can mean a variety of t... - Nov 09, 2007 by Hussman
Best I can tell (Factory is in Mexico) is no solder from pas... - Nov 09, 2007 by devajj
Hopefully this will help you. I happen to have a few similar... - Nov 09, 2007 by Mark M.
Hello, there are some questions first to be answered: 1. Wh... - Nov 10, 2007 by Mika
1. What is the body size? Who cares. 2. What is the pitch?... - Nov 10, 2007 by Real Chunks
Hi Real Chunks, Nice to meet you. Well, I certainly not ag... - Nov 10, 2007 by Mika
BTW, The surrounded QFN fine pitch terminals should have the... - Nov 10, 2007 by Mika
Chunks is right, reduce center pad by 50% print the signal p... - Nov 12, 2007 by RDR
> BTW, The surrounded QFN fine pitch terminals > sho... - Nov 12, 2007 by devajj
You need to perform process a capability study prior to putt... - Nov 12, 2007 by RDR
recently, we also have problem with QFN around 3% defect rel... - Nov 14, 2007 by Reypal
Just to add to the subject, we experienced insufficient sold... - Nov 15, 2007 by Dback
So you are saying that 0.13 mm stencil thichknes and 20% red... - Nov 16, 2007 by Mika
We have found differing results based on the pattern used wh... - Nov 19, 2007 by Hegemon
BINGO! Now that's engineering! ... - Nov 19, 2007 by Real Chunks
I'm curious to know what the pitch of the outer pads is/was ... - Jul 07, 2008 by thughes
We used these same type of parameters regardless of the QFN ... - Jul 11, 2008 by Hegemon
Thanks! ... - Jul 11, 2008 by thughes