Books for SMT

DAVE�S BOOKSHELF

ASSEMBLER�S ESSENTIALS

Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989

I know, I know. The book was written in 1989!!!! I use this book more than any other book. It lays-out the principals. It is well written, documented, and illustrated. And it is understandable.

Title: Printed Circuits HandbookEditor: Clyde F. CoombsPublisher: McGraw-Hill PublishingISBN: 0071350160Publication date: August 2001

If the building were on fire, on the way out the door, I'd grab the picture of my wife from my desk and from the bookshelf my copies of Coombs' Printed Circuits Handbook and Klein-Wassink's �Soldering in Electronics�. It is THE printed circuit answer book, resolving more workaday questions than any other single source in electronics, covering the fundamentals of printed circuit design, fabrication, assembly, test, and quality. Top contributors from Motorola, Cisco, Compaq, Agilent, Hewlett-Packard, and other major companies have authored chapters. It does everything correct. Even with almost 50 chapter authors, the book refers to material in other chapters, has minimal repetition between chapters, is well written and edited, and contains a comprehensive glossary and an index that is useful. AND it includes a CD-ROM with the entire book in searchable format [although only one chapter at a time], which is very cool, because when you need an answer, there are few things more frustrating than being unable to find the answer that you KNOW is in the book [but for the life of you can�t find].

INTRODUCTION TO PCB DESIGN

Title: Surface-Mount Technology for PC BoardsAuthor: James HollomanPublisher: PROMPT PublicationsISBN: 0790610604Publication date: July 1995

For the working engineer or manager, the student or the interested layman, who would like to learn to deal effectively with the many trade-offs required to produce high manufacturing yields, low test costs, and manufacturable designs using SMT. The information presented in this book includes the benefits and limitations of SMT components, manufacturing methods, reliability and quality assurance, and practical applications.

WIRE BONDER�S TOOLS

Title: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and YieldAuthor: George G. Harman, IMAPSPublisher: McGraw-Hill PublishingISBN: 0070326193 Publication date: August 1997

An excellent book for those involving in troubleshooting wire bonding production processes and those doing failure analysis of wire bonded components. It�s primary utility was for those involved in back end of the line integrated circuit and other semiconductor component assembly and failure analysis laboratories. A few of years ago, �Wire Bonding in Microelectronics� seemed less relevant to electric circuit board assembly than it does today. Today, the wider acceptance and use of multichip modules and chip on board technologies as mainstream technologies make this book an important tool for practitioners in electric circuit board assembly. Mr. Harmon assumes the basics of operating wire bonding equipment are well understood. So only a small part of the book is elementary and it generally expects readers to be conversant in wire bonding, device packaging, hybrid, or multichip module circuit assembly technology. The book is well written, edited, and understandable without excessive amounts of jargon, regardless of the audience. The primary focus is failure mechanisms and yield problems originating from chip-to-package wire bonds, but other wire bonds are also considered.

INTEGRATED CIRCUITS

Title: Microchip Fabrication, A Practical Guide to Semiconductor ProcessingAuthor: Peter Van ZantPublisher: McGraw-Hill PublishingISBN: 0071356363Publication date: April 2000

This is semiconductor processing for novices. So, it is a readable and comprehensive guide to semiconductor processing, and might be considered the bible of basic microchip technology for high-powered engineers and technology-clueless salespeople alike. It has easy-reading explanations of semiconductor materials and process chemicals; contamination control; process yields; basic patterning; doping, deposition, and metallization; wafer, device, and circuit evaluation; semiconductor devices and integrated circuit formation and types; and packaging.

BAR CODING BASICS

Title: The Bar Code Book: Reading, Printing, Specification, and ApplicationAuthor: Roger C. PalmerPublisher: Helmers Publishing, Inc. ISBN: 0911261095Publication date: 1995 [4th edition (January 2001) available]

�The Bar Code Book: Reading, Printing, Specification, and Application� by Roger C. Palmer covers the latest technology behind the bar codes and scanners that companies use every day. It�s an excellent reference for anyone with hands-on responsibility for bar coding. The book provides valuable practical advice on inventory control, work-in-process tracking, shipping/receiving, EDI, retail environments, warehousing, health care, and many other on-the-job applications. If you buy only one book on bar coding, this is THE book.

ESD PROGRAM IMPLEMENTATION

Title: ESD Program ManagementAuthor: G. Theodore DangelmayerPublisher: Kluwer Academic PublishersISBN: 0412136716Publication date: February 1999

Highly recommended for those aiming to understand and improve their static control plan. The author believes that static control programs need not be �cookie cutter� implementations with everyone scurrying around in �smurf coats� and buying into all the �Chicken Little� warnings posed by ESD product suppliers. He does a good job of supporting his points with data and references to published documentation. A goal of the book is providing a path for smaller companies to develop effective and efficient programs, rather haphazard approaches that often end-up being too expensive to implement properly. At first, this may appear contrary to expectations about a book written by someone from Lucent Technologies, but it was written with a cost control philosophy. Lucent took this approach to provide tools to help their suppliers improve processes, while not forcing them out-of-business with a heavy handed mandated static control program.

FLEX CIRCUITS

Title: Flexible Circuit TechnologyAuthor: Joseph Fjelstad Publisher: Silicon Valley Publishers Group ISBN: 0966707508Publication date: August 1, 1998

Flexible circuits are used in nearly every imaginable type of electronic product and represent one of the fastest growing interconnection markets. However, users that were not fully prepared and lacked specific knowledge to prevent problems experienced problems when entering into the flex circuit arena. This book provides that basic knowledge and helps build a foundation for advancing the boundaries for this remarkably useful interconnection technology.

ARRAY TECHNOLOGY

Title: Ball Grid Array TechnologyAuthor: John Lau Publisher: McGraw-Hill PublishingISBN: 007036608XPublication date: November 1994

The trend toward higher input/output, higher performance, and higher board-manufacturing yield made the Ball Grid Array (BGA) the package of choice. This book is a one-stop guide to state-of-the-art BGA technology. For professionals active in BGA research and development, those who wish to master BGA problem-solving methods, and those who must choose a cost-effective design and high yield manufacturing process for their interconnect systems, this is a summary of progress in all aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection.

FLIP CHIPS

Title: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesAuthor: John Lau Publisher: McGraw-Hill PublishingISBN: 0071351418Publication date: February 2000

Low-Cost Flip Chip Technologies discusses the economic, design, materials, process, equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This overview explains apply of flip chip technologies to direct chip attach (DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. It covers flip chip problem-solving methods; presents choices for cost-effective design; and describes reliable, high-yield manufacturing process for interconnect systems. Topics are: IC trends and packaging technology updates, wafer-bumping methods, lead-free solder alloys, sequential build up PCB with microvias and via-in-pad, and under-fill materials.

REFLOW SOLDERING

Title: Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip TechnologiesAuthor: Dr. Ning-Cheng Lee Publisher: Butterworth-Heinemann ISBN: 0750672188Publication date: December 2001

This is an excellent book for manufacturing design and process engineers. It is written using a very practical, hands-on approach that provides engineers the means to increase their understanding of the principles of soldering, flux, and solder paste. It presents cutting-edge technology in a fast changing field by covering of the principles of soldering, flux, solder paste technology, area array packages, bumping technique, assembly, and the rework process. The author's expertise and knowledge shine through on topics that are expertly researched, written, and organized to best get his point across. Dr. Lee�s book is well written and illustrated and makes the soldering process and it�s troubleshooting very approachable.

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BETTER BOOKS

Automatic Test Automatic Test Equipment; Allan C. Stover; McGraw-Hill; ISBN: 0070617929 Building a Successful Board-Test Strategy; Stephen F. Scheiber; Butterworth-Heinemann; ISBN: 0750672803; 2nd Edition; [October 2001] Test And Design Strategies For Successful Testing Of SMT High-Density PCB; Robert J. Hanson; Americom Test & SMT Technology; [2001]

Array Packaging Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo (Editor); McGraw-Hill Professional Publishing; ISBN: 0071374930; 1st edition; [November 2001] Ball Grid Array Technology; John Lau; McGraw-Hill Publishing; ISBN: 007036608X; [November 1994] Chip Scale Package: Design, Materials, Process, Reliability, and Applications; John Lau, Ricky Lee; McGraw-Hill Professional; ISBN: 0070383049; [February 1999] Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Publishing; ISBN: 0071351418; [February 2000] Multichip Module Technology Handbook; Philip Garrou, IMAPS (ISHM), Iwona Turlik; McGraw-Hill Professional; ISBN: 0070228949; [September 1997]

Background [getting started] Applied Surface Mount Assembly: A Guide to Surface Mount Materials and Processes; Robert J. Rowland, Paul Belangia; Van Nostrand Reinhold; ISBN: 0442007272; 1st edition; [January 1993] Automatic Test Equipment; Allan C. Stover; McGraw-Hill; ISBN: 0070617929 Electronic Assembly Fabrication; Charles Harper [editor], McGraw-Hill Professional, ISBN: 0071378820; [March 2002] IC Layout Basics: A Practical Guide; Christopher Saint, Judy Saint; McGraw-Hill Professional Publishing; ISBN: 0071386254; 1st edition (November 2001) Printed Circuit Assembly Design; Leonard Marks, James A. Caterina; McGraw Hill Text; ISBN: 0070411077; [July 2000] Surface Mount Technology: Principles and Practice; Ray P. Prasad; Kluwer Academic Publishers; ISBN: 0412129213; 2nd edition; [April 1997]

Cleaning Aqueous Cleaning Handbook; MC McLaughlin, AS Zisman; Morris-Lee Publishing Group; ISBN: 096453567X; [1998] Cleaning And Contamination Of Electronics Components And Assemblies; BN Ellis; Electrochemical Publications; ISBN 0901150207 Handbook for Critical Cleaning; Barbara & Ed Kanegsberg; CRC Press; ISBN: 0849316553; [December 2000] Handbook of Aqueous Cleaning Technology For Electronic Assemblies; FR Cala, AE Winston; Electrochemical Publications; ISBN: 0901150312; [1996]

Components Passive Electronic Component Handbook; Charles A. Harper (Editor); McGraw-Hill Professional Publishing; ISBN: 0070266980; 2nd edition (June 1, 1997)

Electronics Design Bare Board PWB Design Manual; Norman S Einarson; Printed Circuit Technology; [1995] Cooling Techniques For Electronic Equipment; DS Steinberg; John Wiley & Sons; ISBN: 0471524514; 2nd edition; [1991] Design Guidelines for Surface Mount and Fine Pitch Technology; Verb Solberg; McGraw Hill; 2nd E; ISBN: 007136045X; [2000] Electrical Engineering For The Non-Degreed Engineer; Douglas Brooks; UltraCAD Designs; [2000] Printed Circuit Assembly Design; Leonard Marks, James A. Caterina; McGraw Hill Text; ISBN: 0070411077; [July 2000] SMT High Density Design and DFM; James C. Blankenhorn; SMT Plus; ISBN: 1882812034; 3rd Edition; [2001] Surface-Mount Technology for PC Boards; James Holloman; PROMPT Publications; ISBN: 0790610604; [July 1995] Vibration Analysis For Electronic Equipment; DS Steinberg; John Wiley & Sons; ISBN: 047137685X; 3rd edition

Flexible Circuits Flexible Circuit Technology; Joseph Fjelstad; Silicon Valley Publishers Group; ISBN: 0966707508; [August 1998] Flexible Printed Circuitry; Thomas H. Stearns; McGraw-Hill Professional Publishing; ISBN: 0070610320; (November 1995)

Integrated Circuits, Back-End Processes Hybrid Microelectronics Handbook; Jerry E. Sergent; McGraw-Hill Professional Publishing; ISBN: 0070266913; 2nd edition (July 1995) IC Layout Basics: A Practical Guide; Christopher Saint, Judy Saint; McGraw-Hill Professional Publishing; ISBN: 0071386254; 1st edition (November 2001) Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield; George G. Harman, IMAPS; McGraw-Hill Publishing; ISBN: 0070326193; [August 1997] Microchip Fabrication, A Practical Guide to Semiconductor Processing; Peter Van Zant; McGraw-Hill Publishing; ISBN: 0071356363 [April 2000]

Materials Properties, Materials Science, Electronic Packaging Handbook; Glenn R. Blackwell (Editor); CRC Press; ISBN: 0849385911; (November 29, 1999) Materials for Electronic Packaging; Deborah D.L. Chung (Editor); Butterworth-Heinemann; ISBN: 0750693142; (April 1995) Materials Science and Engineering: An Introduction; WD Callister; John Wiley & Sons; 5th edition; ISBN: 0471320137; [1999]

Other Processes Bar Code Book: Reading, Printing, Specification, and Application; Roger C. Palmer; Helmers Publishing; ISBN: 0911261095; [1995; 4th edition (January 2001) available] ESD Program Management; G. Theodore Dangelmayer; Kluwer Academic Publishers; ISBN: 0412136716; [February 1999]

PCB Fabrication Printed Circuit Board Materials Handbook; Martin W. Jawitz (Editor); McGraw-Hill Professional Publishing; ISBN: 0070324883; 2nd edition; [May 1997] Printed Circuits Handbook; Clyde F. Coombs [Editor]; McGraw-Hill Publishing; ISBN: 0071350160; [August 2001]

Productivity

Quality Control, Statistics, Taguchi, And The Like Acceptance Sampling in Quality Control; Edward G Schilling; Marcel Dekker; ISBN: 0824713478; (February 1982) How to Perform Skip Lot and Chain Sampling; Kenneth S. Stephens; American Society for Quality; 2nd edition Vol 4; ISBN: 0873893255; [1995] Reliability Improvement with Design of Experiment; Lloyd W. Condra; Marcel Dekker; ISBN: 0824705270; 2nd edition; [April 2001] SPC Methods for Quality Improvement; Charles P. Quesenberry; John Wiley & Sons; ISBN: 0471130877; 1st edition (March 1997) Statistical Procedures for Machine and Process Qualification; Edgar Dietrich, Alfred Schulze; American Society for Quality; ISBN: 0873894472; (February 1999) Statistical Process Control for SMT; Dr. William Messina; Datasleuths; ISBN: 0967503396; 1999 Statistical Quality Control; Eugene L. Grant, Richard S. Leavenworth (Contributor); McGraw Hill Text; ISBN: 0078443547; 7th edition (January 1996) Understanding Industrial Experimentation; Donald J. Wheeler; SPC PRESS (Statistical Process Control); ISBN: 0945320094; 2nd edition (June 1990) World Class Quality: Using Design of Experiments to Make It Happen; Keki R. Bhote, Adi K. Bhote; AMACOM; ISBN: 0814404278; 2nd edition (November 1999)

Reliability, Failure Analysis Accelerated Testing: Statistical Models, Test Plans, And Data Analysis; John Wiley & Sons; ISBN: 0471522775; [1990] ASM Handbook: Corrosion; Lawrence J. Korb [Editor]; ASM International; ISBN: 0871700190; 9th edition (April 1989) Electronic Failure Analysis Handbook; Perry L. Martin; McGraw-Hill Professional Publishing; ISBN: 0070410445; [February 1999] Failure Modes and Mechanisms in Electronic Packages; Puligandla Viswanadham, Pratap Singh; Kluwer Academic Publishers; ISBN: 0412105918; 1st edition; [January 1998]

SMT Assembly A Comprehensive Guide To The Design And Manufacture Of Printed Board Assemblies - Volume 1 & 2; W. MacLeod Ross; Electrochemical Publications; V1: ISBN [V1] 0901150320, [V2] 0901150339; [1996] A Scientific Guide To Surface Mount Technology; C. Lea; Electrochemical Publications; ISBN 090150223; [1988] Manufacturing Techniques For Surface Mounted Assemblies; RJ Klein Wassink & M. MF Verguld; Electrochemical Publications; ISBN 0901150304; 1st edition; [1995] Surface Mount Technology With Fine Pitch Components: The Manufacturing Issues; Hans Danielsson; Chapman & Hall; ISBN: 0412553406; 1st edition; [February 1995]

SMT Introduction Applied Surface Mount Assembly: A Guide to Surface Mount Materials and Processes; Robert J. Rowland, Paul Belangia; Van Nostrand Reinhold; ISBN: 0442007272; 1st edition; [January 1993] Surface Mount Technology: Principles and Practice; Ray P. Prasad; Kluwer Academic Publishers; ISBN: 0412129213; 2nd edition; [April 1997]

Soldering Process Basics of Soldering; Armin Rahn; John Wiley & Sons; ISBN: 0471584711; (March 1993) Handbook of Machine Soldering; Ralph W. Woodgate; John Wiley & Sons; ISBN: 0471139041; 3rd edition (September 1996) Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies; Dr. Ning-Cheng Lee; Butterworth-Heinemann ; ISBN: 0750672188; [December 2001] SMT Soldering Handbook; Rudolf Strauss; Butterworth-Heinemann; ISBN: 0750635894; 2nd edition (June 1998) Soldering in Electronics Assembly; Mike Judd, Keith Brindley; Newnes; ISBN: 0750635452; 2nd edition (March 1999) Solders and Soldering; Howard H. Manko; McGraw-Hill Professional Publishing; ISBN: 0071344179; 4th edition (February 2001)

Soldering Science Design and Reliability of Solders and Solder Interconnections; RK Mahidhara [editor], SML Sastry [editor], PK Liaw [editor], KL Murty [editor], DR Frear [editor], and WL Winterbottom [editor]; Minerals Metals & Materials Society; ISBN: 0-87339-354-6; A collection of papers from the 1997 TMS Annual Meeting in Orlando, Florida, February 9-13, 1997. Lead-Free Solder - Technology & Applications For Environmentally Friendly Manufacturing; Dr. J. Hwang; Electrochemical Publications; ISBN: 0901150401; [2001] Mechanics of Solder Alloy Interconnects; J.H. Lau (Editor), Darrel R. Frear, Harold Morgan (Editor), Steve Burchett (Editor); Kluwer Academic Publishers; ISBN: 0442015054; (May 1994) Mechanics of Solder Alloy Wetting & Spreading; DR Frear (Editor), Frederick G. Yost (Editor), F. Michael Hosking (Editor); Kluwer Academic Publishers; ISBN: 0442017529; 1st edition [January 1993] Modern Solder Technology for Competitive Electronics Manufacturing; Jennie S. Hwang; McGraw-Hill Professional Publishing; ISBN: 0070317496; 7 edition (April 1996) Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies; John Lau, Yi-Hsin Pao; McGraw-Hill Professional; ISBN: 0070366489; [September 1996] Solder Joint Reliability: Theory & Applications; JH Lau [editor]; Van Nostrand Reinhold; ISBN:0442002602; [1991] Solder Mechanics: A State of the Art Assessment; DR Frear (Editor); Minerals Metals & Materials Society; ASIN: 0873391667; (June 1990) Soldering Handbook; Dr. Paul T. Vianco; American Welding Society; ISBN: 0871716186; [2000] Soldering in Electronics, RJ Klein Wassink; Electrochemical Publications; ISBN: 090115024X; [December 1989]

BOOKS THAT ARE NOT WORTH THE MONEY Handbook Of Electronics Manufacturing Engineering; Bernie Matisoff; Chapman & Hall, International Thomson Publishing; ISBN: 0412086115; 3rd Edition; [1997] Optimizing Quality in Electronics Assembly: A Heretical Approach; James Allen Smith, Frank B. Whitehall, Jim Smith, Mark Oliver (Contributor); McGraw-Hill Professional Publishing; ISBN: 0070592292; (November 1996) Surface Mount Handbook; Keith J Gurnett; Reed Electronics Research; ISBN: 0750647493; [1999] Taguchi Techniques For Quality Engineering; Phillip J. Ross; McGraw-Hill Professional Publishing; ISBN: 0070539588; 2nd edition; (August 1995)

Productivity, Required Reading All I Need to Know About Manufacturing I Learned in Joe's Garage; William B. Miller, Vicki L. Schenk; Bayrock Press; ISBN: 0963043935; revised edition (October 2001) Implementing World Class Manufacturing - Shop Floor Manual; Larry Rubrich, Madelyn Watson, Shirley Rubrich (Editor); WCM Associates; ISBN: 0966290607; Spiral edition (July 1998) Rivethead: Tales from the Assembly Line; Ben Hamper; Warner Books; ISBN: 0446394009; Reprint edition (July 1992) The Goal: A Process of Ongoing Improvement; Eliyahu M. Goldratt, Jeff Cox; North River Press Publishing Corporation; ISBN: 0884270610; 2nd Rev edition (1992) The Machine That Changed the World: The Story of Lean Production; James P. Womack, et al; HarperCollins; ISBN: 0060974176; Reprint edition (November 1991) The Team Handbook; Peter R. Scholtes, Brian L. Joiner, Dale Mann (Illustrator), Barbara J. Streibel; Oriel Inc; ISBN: 1884731112; 2nd edition (June 1, 1996)

Productivity, Thinking Lean; Becoming Lean: Inside Stories of U.S. Manufacturers; Jeffrey K. Liker (Editor); Productivity Press; ISBN: 1563271737; (February 1998) Implementing a Lean Management System; Thomas L. Jackson, Karen R. Jones (Contributor); Productivity Press; ISBN: 1563270854; (April 1996) Lean Manufacturing for the Small Shop; Conner B. Gary, Gary Conner; Society of Manufacturing Engineers; ISBN: 0872635201; (January 5, 2001) Lean Thinking; James P. Womack, Daniel T. Jones; Simon & Schuster; ISBN: 0684810352; 1st edition (January 15, 1996) Lean Transformation: How to Change Your Business into a Lean Enterprise; Bruce A. Henderson, Jorge L. Larco, Stephen H. Martin (Editor); Oaklea Pr; ISBN: 0964660121; (May 1999) Manufacturing Operations and Supply Chain Management: The LEAN Approach; David Taylor, David Brunt; International Thomson Business Press; ISBN: 1861526040; 1st edition (January 15, 2000) Running Today's Factory: A Proven Strategy for Lean Manufacturing; Charles Standard, Dale Davis; Hanser Gardner Pubns; ISBN: 1569902577; (October 1999)

Productivity, Thinking Japanese [written in Japlish] A Field Guide to Focused Planning: Hoshin Kanri-American Style; Joseph F. Colletti; The Woodledge Group; ISBN: 0965071812; 2nd edition (December 1996) Art of Japanese Management; Richard Tanner Pascale; Simon & Schuster; ASIN: 0671225391; (May 1981) Kaizen: The Key To Japan's Competitive Success; Masaaki Imai; McGraw-Hill/Irwin; ISBN: 007554332X; (November 1, 1986) Kanban Just-In-Time at Toyota: Management Begins at the Workplace; David J. Lu (Translator); Productivity Press; ISBN: 0915299488; Rev. Ed. edition (May 1989) Poka-Yoke: Improving Product Quality by Preventing Defects; Nikkan Kogyo Shimbun (Editor), Factory Magazine (Editor), Nikkan Kogyo Shimbun, Ltd., Factory Magazine; Productivity Press; ISBN: 0915299313; (January 1989) The Visual Factory: Building Participation Through Shared Information; Michel Greif; Productivity Press; ISBN: 0915299674; (May 1991) Toyota Production System: Beyond Large-Scale Production; Taiichi Ono, Taiichi Ohno; Productivity Press; ISBN: 0915299143; (February 1988) Zero Quality Control: Source Inspection and the Poka-Yoke System; Shigeo Shingo, Andrew P. Dillon (Translator); Productivity Press; ISBN: 0915299070; (May 1986) 5 Pillars of the Visual Workplace: The Sourcebook for 5s Implementation; Hiroyuki Hirano, Bruce Talbot (Translator); Productivity Press; ISBN: 1563270471; (February 1995)

Productivity, Maintenance [in Japlish] Autonomous Maintenance in Seven Steps: Implementing TPM on the Shop Floor (TPM) Masaji Tajiri (Preface), Fumio Goto, Fumio Gotoh (Preface); Productivity Press; ISBN: 1563272199; (June 1999) TPM Implementation: A Japanese Approach; Masaji Tajiri, Fumio Gotoh (Contributor); McGraw Hill Text; ASIN: 0070628343; (July 1992) TPM for the Lean Factory: Innovative Methods and Worksheets for Equipment Management; Keniche Sekine, Keisuke Arai, Ken'iche Sekine; Productivity Press; ISBN: 1563271915; (November 1998)

Productivity, It Doesn�t Count Yet The Balanced Scorecard: Translating Strategy into Action; Robert S. Kaplan, David P. Norton; Harvard Business School Pr; ISBN: 0875846513; (September 1996) Throughput Accounting; Thomas Corbett; North River Press Publishing Corporation; ISBN: 0884271587; (December 1, 1998)

Productivity, Other things Attain Manufacturing Excellence; Robert W. Hall; McGraw-Hill Trade; ISBN: 087094925X; (December 1, 1986) Breaking the Constraints to World-Class Performance; H. William Dettmer, William H. Dettmer; ASQ Quality Press; ISBN: 0873894375; 1 edition (July 1, 1998) Cellular Manufacturing: One-Piece Flow for Workteams (Shopfloor Series); Productivity Development Team; Productivity Press; ISBN: 156327213X; 1st edition (June 1999) Handbook of Cellular Manufacturing Systems; Shahrukh A. Irani (Editor); Wiley-Interscience; ISBN: 0471121398; 1st edition (April 15, 1999)

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