I am not expert, just my comment,
the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Omegameter (ROSE) tells you only the equivalent NaCl/cm2 but not which kind of ionic contaminant is in it (Cl, Br, F, .?) If you want to know exactly wich kind of ione it is and rigth % you should run a Ion Chromatography Test.
Any way ( I am not expert) I do not think it is a matter of ionic contamination who compromise the wire bonding.
if suspect is that surface is contaminated, you could run a FT-IR test (at least) and see if the bonding surface is contaminated by some substance that could compromise the bonding.
sorry for my English.
Regards....GS
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