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Drying PCB after contamination measurement for rework ?

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#87684

Drying PCB after contamination measurement for rework ? | 2 March, 2022

I am currently working on a manufacturing flow where some PCBA are processed with reflow oven (after being baked before processing), then cleaned with bath, then passed into contaminometer, passed into AOI. The point is after all of this, if AOI detect some reworking is needed should I bake again the PCBA before using solder iron to correct this PCBA in order to avoid moisture development (considering it passed trough bath and contaminometer device)?

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#87689

Drying PCB after contamination measurement for rework ? | 3 March, 2022

Probably need more info on the PCB and why baking before reflow processing is part of your process, but if you're baking before reflow it makes sense you'd bake before rework.

Is there a reason you don't AOI before wash?

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#87690

Drying PCB after contamination measurement for rework ? | 3 March, 2022

Hello Baking before solder pasting and reflow actually due to poential moisture development. This is JDEC requirement I believe to do so. We AOI after cleaning so we AOI a clean PCBA

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#87695

Drying PCB after contamination measurement for rework ? | 4 March, 2022

Is there a reason the PCBA needs to be cleaned to inspect through AOI? I AOI thousands of "dirty" boards a day without an issue.

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#87700

Drying PCB after contamination measurement for rework ? | 7 March, 2022

This is recommended by our EMS to make sure flux is not cheating AOI.

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