Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues back to the same assemblers? 3) What types of solder connections do your assemblies consist of? (Wire Terminations, PCB Interconnects, Thru-Hole Electronic Components) 4) Are you soldering to a PCB Board? If so, what is the Surface Finish, copper weight, and number of layers?
Please provide as much information as possible.
Thanks
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