Electronics Forum | Wed Mar 24 12:36:26 EST 2004 | wintech
Hello We are using a No-Clean process for a lot of boards that we do, but the customer needs the flux removed off the bottom side of the board and there is to many leaded components that can not go through a water wash, so is what we do is clean th
Electronics Forum | Tue May 02 13:57:21 EDT 2006 | patrickbruneel
What you can do is perforate the board holding rim by drilling holes of 0.6mm (similar to via's). This will reduce the mass and heatsinking capacity, allow excess flux drainage and facilitate convection heat contacting the board through the holes. Th
Electronics Forum | Mon Sep 17 06:11:41 EDT 2012 | kq702
Hi I did a reflow on a laptop board and after the reflow the board is warped in the area I did the reflow in, and now the laptop screen does not turn on at all when I put it back into the laptop. Original problem was the wifi (I did the reflow more o
Electronics Forum | Mon Jun 19 16:59:07 EDT 2000 | D.A.Munro
We use both Nc and Ws at wave and reflow, Nc is less forgiving and the board topside must reach aprox.110c prior to wave to be fully activated. Your application of the flux is even more criticale,it's not very agresive for one thing and apply to much
Electronics Forum | Wed Jul 17 03:36:00 EDT 2002 | robbied
Answers are: *Mainly copper and potassium. *it looks like a soft growth. *customer will not accept this, hence the returns. These boards are either reworked or scrapped. *Flux is not an issue. *The cleaning process has been found to be the cause of t
Electronics Forum | Mon Aug 31 16:30:01 EDT 2020 | emeto
I would question your motive "There's no way that I feel comfortable shipping boards after a selective without cleaning them, the amount of flux on the board is significantly more than from SMT". 1. Who said that residue should be cleaned and why? O
Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Thu Jul 20 14:52:05 EDT 2000 | Bob Willis
If you are talking about Pin In Hole Reflow that is not true, I hope it was not my friends at Speedline that told you that. Stencil printing of paste for through hole reflow can be done. If you get all the parameters right it can give you joints lik
Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F
Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form
Electronics Forum | Fri May 22 13:14:42 EDT 1998 | Earl Moon
| | | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has rece
