Electronics Forum: stencil apertures (Page 94 of 121)

What are some common problems and irritations you run into when cleaning your stencils, PCB's, or anything for that matter???

Electronics Forum | Fri Jun 04 17:44:20 EDT 2021 | dwl

The hardest part was convincing management of the need for a stencil cleaner in the first place. Cleaning by hand using IPA and a lint free cloth just leads to clogged apertures and print defects. BTW, lint free cloths leave behind a lot of lint.

Stencil design for dpack

Electronics Forum | Thu Jan 18 19:16:42 EST 2001 | slowe

I am having problems with D-Packs shifting during reflow. Does anyone know of a good aperture design to solve this problem ? Possibly bow tie.

Controlling Solder Ball Contamination

Electronics Forum | Mon Feb 19 13:21:01 EST 2001 | billschreiber

Thank you for giving me an easy one. Cleaning populated PCBs in a stencil cleaner can be a nightmare! Please see my response to the question by MartyS on "Fine-pitch Apertures". If this doesn't answer your question, let me know.

SPC for MPM UP1500 Stencil Printers

Electronics Forum | Thu Sep 26 20:25:06 EDT 2002 | davef

When we DOE a board, we use the following independent print variables: * Print pressure * Print speed * Separation speed * Aperture orientation * Squeegee hardness

0201 Aperture design

Electronics Forum | Thu Oct 03 18:45:56 EDT 2002 | davef

Get started with an "On-Board Forum" [blue bar an inch down from the top of the page] moderated by Jeff Schake at DEK that was a discussion focused on stencil printing issues with 0201 technology. Chris: Are you putting 0201 on flex? If so, sounds

0201 Aperture design

Electronics Forum | Sat Oct 12 05:05:09 EDT 2002 | Kenture

I run 0201 on a 5 mils stencil with openting of 15X12 and did not have any issue. The major concern is the placement and CP643 did very good job. Type 3 solder pastes was used. Good luck.

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 13:33:09 EST 2002 | pjc

square apertures provide better paste release than round in most applications. See IPC 7525 Stencil Design Guidelines

CyberOptics SE300

Electronics Forum | Wed Sep 01 11:09:45 EDT 2004 | burgosa

We are considering the CyberOptics SE300 for solder paste inspection at post-stencil print. Does anyone have experience with this AOI machine? How it works with small apertures like 0201's and uBGA's? Comments are welcome. Thanks

Fine Pitch Stencil Design

Electronics Forum | Thu Dec 08 09:47:46 EST 2005 | slthomas

I'm with Grant on the .005" foil thickness. The key is to keep your aspect ratio (aperture width/foil thickness) over 1.5, laser cut, and I like trapezoidal aps. too.

Fine Pitch Stencil Design

Electronics Forum | Fri Dec 09 04:38:11 EST 2005 | Rob

Madam, that's rather forward! By zipper pattern do you mean offsetting the apertures on every other ultra fine pitch qfp pad? Thanks, Rob. (we don't roll in England, we amble)


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