Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Wed Nov 08 14:28:39 EST 2000 | Finepitch Services
the current design must be a die-up one, so routing for a flip-chip on board will be a bit difficult. it almost HAS to be wire bonded, to me...
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Thu Jan 20 09:30:09 EST 2005 | russ
That's what I thought it was. We may very well contract this out. We don't have underfill capability and the volumes may not warrant us investing. Do you know of someone doing this? I don't know at this time if it is the flip chip or the wire
Electronics Forum | Tue Jan 09 21:33:49 EST 2007 | davef
Setup Guy Thanks for the compliment. So, COB is not SMT. What is it? What kind of assembly areas do they use to print, place, reflow, and glob-top [or wire bond / encapsulate] COB? Any information you gave give to clairify this is appreciated.
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Thu Jan 15 21:16:18 EST 2009 | davef
Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis
Electronics Forum | Wed Mar 11 10:55:07 EDT 2009 | gpost
I had contacted the dummy component suppliers but they didn't have anything that would work. We designed a simple daisy-chain PCB and die for SPC and training purposes, and purchased large quantities.
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