Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
We have various euipment avilable: Re-flow ovens Tape & Reel Inpsection Test Marking Probers Ovens - Burn-in, Temp Cycle, Thermal Shock, Humidity and temp.
WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Technical Library | 2012-04-26 18:52:37.0
First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva
Technical Library | 2018-08-29 21:17:53.0
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern.
Quick Overview Max 180 x 235mm soldering area Infrared IC Heater T962 is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD、BAG soldering a request on a PCB assembly. The T962
New Equipment | Cleaning Equipment
Fiber optic test need the thermal inducing system temperature cycling system. Because fiber optic test equipment is an important supporting force in the communication industry. It penetrates in communication chip, module, terminal, base station, wire
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
