Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2015-02-28 18:10:22.0
Engineered Materials Systems introduces its new DB-1541-S9 Low-Cost Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. DB-1541-S9 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2024-05-27 12:39:02.0
Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe. The event will take place June 11-13, 2024 in Nuremberg, Germany. This latest advancement aims to revolutionize thermal performance in electronic manufacturing, addressing industry challenges head-on.
Industry News | 2018-10-27 16:04:56.0
Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Industry News | 2018-11-07 14:41:49.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Industry News | 2013-04-25 16:35:51.0
Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.
Industry News | 2015-05-18 20:52:11.0
Engineered Materials Systems introduced its new EMS 561-147-2 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-147-2 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.
Industry News | 2016-11-14 19:45:24.0
Engineered Materials Systems is pleased to introduce its new EMS 561-567 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-567 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Industry News | 2014-05-05 11:18:08.0
Indium Corporation technology experts will present at PCIM Europe May 20-22 in Nuremberg, Germany.
