ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wedge-shear?con=t&page=5
… Cold Bump Pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/042921-what-are-the-advantages-of-a-desktop-automated-dispensing-system
. The pencil camera can be used if your deposit is larger than 110 microns and/or if there is a high contrast between the fluid and the substrate
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Temperature-Monitoring-Camera-Sensor-Guide-22200623.pdf
a substrate in the work area of the dispense system to confirm the substrate is at operating temperature prior to running a process
GPD Global | https://www.gpd-global.com/pdf/doc/Temperature-Monitoring-Camera-Sensor-Guide-22200623.pdf
a substrate in the work area of the dispense system to confirm the substrate is at operating temperature prior to running a process
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-printed-circuit-board-use-for/
. They have a unique manufacturing process that sets them apart from all other options. Printing is the process of placing each component onto the base material known as a substrate
| https://www.smtfactory.com/What-is-an-LED-Flip-Chip-id3680601.html
. SMT PRODUCTION LINE CONTACT US You are here: Home » News & Events » What is an LED Flip Chip? What is an LED Flip Chip? Views: 0 Author: I.C.T Publish Time: 2021-01-15 Origin: www.smtfactory.com Inquire Industry Introduction LED flip chip refers to the chip that can be directly bonded with ceramic substrate without welding wire
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-maxiiseries.php
: Underfill Dam and Fill COB Encapsulation and more Substrate Heating Methods Convection/Forced Air - Heat transfers to the product via air flow from below the board
GPD Global | https://www.gpd-global.com/fluiddispense-prod-maxiiseries.php
: Underfill Dam and Fill COB Encapsulation and more Substrate Heating Methods Convection/Forced Air - Heat transfers to the product via air flow from below the board
GPD Global | https://www.gpd-global.com/high-precision-dispensers-maxii.php
: Underfill Dam and Fill COB Encapsulation and more Substrate Heating Methods Convection/Forced Air - Heat transfers to the product via air flow from below the board
