Electronics Forum | Thu Apr 23 07:34:15 EDT 2020 | stephendo
Stencil editing is something that you have to do to do well. And you have to look at the boards after the screen printer and after the oven. Reading white papers ain't gonna cut it. And then there will always be part pad combos that will introduce s
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Thu Jan 18 19:16:42 EST 2001 | slowe
I am having problems with D-Packs shifting during reflow. Does anyone know of a good aperture design to solve this problem ? Possibly bow tie.
Electronics Forum | Thu Nov 30 05:08:40 EST 2006 | aj
5mm. 3.Check that there are fiducials. The above checks are purely for Processing the board thru the machines. There are lots of other checks for stencil design etc. aj...
Electronics Forum | Mon Apr 03 07:46:21 EDT 2006 | cyber_wolf
I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I need to over print them, but how much without causing bridging issues ? Thanks, Sr.
Electronics Forum | Tue Apr 04 14:00:48 EDT 2006 | russ
I have used a .013" square under these conditions. Limited run but all were good. 72 qty in 1 batch run
Electronics Forum | Tue Apr 04 14:12:54 EDT 2006 | cyber_wolf
I did the apertures 1:1 using an Invar foil material. I will post and let you know how it works out. Thanks
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Fri Mar 20 09:29:27 EDT 2020 | slthomas
If you just want a little more paste and don't care where it ends up I guess percentage is OK, but if you're trying control where it ends up it makes sense to specify how far, and in which direction(s).
